Inventor · disambiguated record
Eugene Zhao
Also filed as: ZHAO EUGENE · ZHAO EUGENE Y · ZHAO EUGENE YUEXING
10 granted patents·1 pending application·301 citations·filing 2000–2006
91Inventor score
Top patents by PatentIndex Score
11 records- 0196US6561889B1Methods for making reinforced wafer polishing pads and apparatuses implementing the sameLAM RES CORP·Filed 2000·Granted May 13, 2003·83 cites·35 claims
- 0291US6572463B1Methods for making reinforced wafer polishing pads utilizing direct casting and apparatuses implementing the sameLAM RES CORP·Filed 2000·Granted Jun 3, 2003·56 cites·27 claims
- 0386US6798230B1Structure and method for increasing accuracy in predicting hot carrier injection (HCI) degradation in semiconductor devicesADVANCED MICRO DEVICES INC·Filed 2003·Granted Sep 28, 2004·50 cites·21 claims
- 0485US6641470B1Apparatus for accurate endpoint detection in supported polishing padsLAM RES CORP·Filed 2001·Granted Nov 4, 2003·43 cites·37 claims
- 0574US6949020B2Methods for making reinforced wafer polishing pads and apparatuses implementing the sameLAM RES CORP·Filed 2003·Granted Sep 27, 2005·13 cites·16 claims
- 0674US6712679B2Platen assembly having a topographically altered platen surfaceLAM RES CORP·Filed 2001·Granted Mar 30, 2004·18 cites·40 claims
- 0770US6776917B2Chemical mechanical polishing thickness control in magnetic head fabricationIBM·Filed 2001·Granted Aug 17, 2004·14 cites·34 claims
- 0869US7340360B1Method for determining projected lifetime of semiconductor devices with analytical extension of stress voltage window by scaling of oxide thicknessADVANCED MICRO DEVICES INC·Filed 2006·Granted Mar 4, 2008·7 cites·16 claims
- 0969US6645052B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2001·Granted Nov 11, 2003·12 cites·26 claims
- 1054US6939207B2Method and apparatus for controlling CMP pad surface finishLAM RES CORP·Filed 2003·Granted Sep 6, 2005·5 cites·17 claims
- 1136US2004266192A1Application of heated slurry for CMPLAM RES CORP·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →