Inventor · disambiguated record
Jimmy Chew
Also filed as: CHEW JIMMY · CHEW JIMMY HWEE SENG
11 granted patents·267 citations·filing 2001–2021
87Inventor score
Files withPEP INNOVATION PTE LTD7ADVANPACK SOLUTIONS PTE LTD2ADVANCED SYSTEMS AUTOMATION1CHEW JIMMY HWEE SENG1
Top patents by PatentIndex Score
11 records- 0196US6550666B2Method for forming a flip chip on leadframe semiconductor packageADVANPACK SOLUTIONS PTE LTD·Filed 2001·Granted Apr 22, 2003·250 cites·23 claims
- 0295US11114315B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Sep 7, 2021·5 cites·20 claims
- 0377US11610855B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Mar 21, 2023·1 cites·19 claims
- 0477US11232957B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2020·Granted Jan 25, 2022·1 cites·20 claims
- 0576US11233028B2Chip packaging method and chip structurePEP INNOVATION PTE LTD·Filed 2020·Granted Jan 25, 2022·1 cites·17 claims
- 0674US11062917B2Packaging method, panel assembly, wafer package and chip packagePEP INNOVATION PTE LTD·Filed 2019·Granted Jul 13, 2021·1 cites·16 claims
- 0773US11538695B2Packaging method, panel assembly, wafer package and chip packagePEP INNOVATION PTE LTD·Filed 2019·Granted Dec 27, 2022·1 cites·20 claims
- 0866US12080565B2Chip packaging method and package structurePEP INNOVATION PTE LTD·Filed 2021·Granted Sep 3, 2024·0 cites·14 claims
- 0953US7692440B2Handler for semiconductor singulation and method thereforADVANCED SYSTEMS AUTOMATION·Filed 2003·Granted Apr 6, 2010·7 cites·29 claims
- 1052US10763133B2Semiconductor structure and semiconductor package device using the sameADVANPACK SOLUTIONS PTE LTD·Filed 2018·Granted Sep 1, 2020·0 cites·10 claims
- 1142US10109503B2Method of manufacturing semiconductor package deviceCHEW JIMMY HWEE SENG·Filed 2012·Granted Oct 23, 2018·0 cites·27 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →