Inventor · disambiguated record
Dirk Siepe
Also filed as: SIEPE DIRK · SIEPE DIRK HUBERT
9 granted patents·3 pending applications·25 citations·filing 2004–2022
83Inventor score
Top patents by PatentIndex Score
12 records- 0180US8164176B2Semiconductor module arrangementSIEPE DIRK·Filed 2006·Granted Apr 24, 2012·10 cites·9 claims
- 0276US9196562B2Semiconductor arrangement, semiconductor module, and method for connecting a semiconductor chip to a ceramic substrateSIEPE DIRK·Filed 2011·Granted Nov 24, 2015·4 cites·15 claims
- 0373US7851913B2Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apartINFINEON TECHNOLOGIES AG·Filed 2006·Granted Dec 14, 2010·6 cites·37 claims
- 0460US7654434B2Method, device and system for bonding a semiconductor elementINFINEON TECHNOLOGIES AG·Filed 2006·Granted Feb 2, 2010·2 cites·11 claims
- 0560US2024239891A1Receptor elimination by ubiquitin ligase recruitmentUNIV LELAND STANFORD JUNIOR·Filed 2022·Application pending·0 cites
- 0659US7597235B2Apparatus and method for producing a bonding connectionINFINEON TECHNOLOGIES AG·Filed 2007·Granted Oct 6, 2009·2 cites·12 claims
- 0749US9129934B2Power semiconductor module and method for operating a power semiconductor moduleHARTUNG HANS·Filed 2010·Granted Sep 8, 2015·1 cites·11 claims
- 0842US8198721B2Semiconductor moduleBAYERER REINHOLD·Filed 2006·Granted Jun 12, 2012·0 cites·15 claims
- 0942US2009127317A1Device and method for producing a bonding connectionINFINEON TECHNOLOGIES AG·Filed 2007·Application pending·0 cites
- 1039US2005077175A1Miniaturized analytical systemFiled 2004·Application pending·0 cites
- 1138US8541892B2Bonding connection between a bonding wire and a power semiconductor chipSIEPE DIRK·Filed 2010·Granted Sep 24, 2013·0 cites·20 claims
- 1232US8955219B2Method for fabricating a bondROTH ROMAN·Filed 2010·Granted Feb 17, 2015·0 cites·24 claims
Join the waitlist — get patent alerts
Get an alert when Dirk Siepe files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →