Inventor · disambiguated record
Yoshihisa Yamashita
Also filed as: YAMASHITA YOSHIHISA
85 granted patents·13 pending applications·1,187 citations·filing 1997–2024
99Inventor score
Files withMATSUSHITA ELECTRIC INDUSTRIAL CO LTD27CANON KK23PANASONIC CORP21PANASONIC IP MAN CO LTD11NAKATANI SEIICHI3
Top patents by PatentIndex Score
98 records- 0197US6399257B1Color filter manufacturing method, color filter manufactured by the method, and liquid crystal device employing the color filterCANON KK·Filed 2000·Granted Jun 4, 2002·157 cites·16 claims
- 0295US6921433B2Aqueous dispersion of water-insoluble-colorant-containing particle and preparation process thereof, water-insoluble-colorant-containing particle and preparation process thereof, and inkCANON KK·Filed 2003·Granted Jul 26, 2005·55 cites·26 claims
- 0395US6871396B2Transfer material for wiring substrateMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Mar 29, 2005·69 cites·22 claims
- 0495US6501527B1Liquid crystal elemental device, production process thereof and spacer-bearing substrateCANON KK·Filed 2000·Granted Dec 31, 2002·69 cites·3 claims
- 0593US7247178B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Granted Jul 24, 2007·20 cites·21 claims
- 0693US6860004B2Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sinkMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 1, 2005·68 cites·3 claims
- 0792US8389600B2Ink jet recording method, and ink jet recording apparatusSUZUKI KATSUHIKO·Filed 2009·Granted Mar 5, 2013·19 cites·15 claims
- 0892US6964700B2Ink for use in ink jet recording and ink jet recording method utilizing the sameCANON KK·Filed 2004·Granted Nov 15, 2005·34 cites·13 claims
- 0991US7773386B2Flexible substrate, multilayer flexible substratePANASONIC CORP·Filed 2007·Granted Aug 10, 2010·13 cites·11 claims
- 1091US7394663B2Electronic component built-in module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Jul 1, 2008·50 cites·15 claims
- 1190US7205483B2Flexible substrate having interlaminar junctions, and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Apr 17, 2007·17 cites·20 claims
- 1290US6570099B1Thermal conductive substrate and the method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted May 27, 2003·53 cites·20 claims
- 1389US6958535B2Thermal conductive substrate and semiconductor module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Oct 25, 2005·45 cites·24 claims
- 1488US7799607B2Process for forming bumps and solder bumpPANASONIC CORP·Filed 2005·Granted Sep 21, 2010·16 cites·21 claims
- 1588US7611040B2Method for forming solder bump and method for mounting semiconductor device using a solder powder resin compositionPANASONIC CORP·Filed 2006·Granted Nov 3, 2009·13 cites·12 claims
- 1688US7126811B2Capacitor and method for producing the same, and circuit board with a built-in capacitor and method for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 24, 2006·34 cites·30 claims
- 1788US6707671B2Power module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Mar 16, 2004·42 cites·45 claims
- 1887US7959280B2Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatusCANON KK·Filed 2007·Granted Jun 14, 2011·6 cites·4 claims
- 1987US7909449B2Ink jet recording apparatus and ink jet recording methodCANON KK·Filed 2008·Granted Mar 22, 2011·9 cites·9 claims
- 2087US6522555B2Thermally conductive board, method of manufacturing the same, and power module with the same incorporated thereinMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Feb 18, 2003·38 cites·12 claims
- 2186US6339461B1Method for forming spacers, manufacturing method for a color filter having the spacers, and liquid crystal element formed by using the manufacturing methodCANON KK·Filed 2000·Granted Jan 15, 2002·30 cites·8 claims
- 2285US8011777B2Ink set, ink jet recording method, ink cartridge, recording unit, and ink jet recording apparatusCANON KK·Filed 2008·Granted Sep 6, 2011·7 cites·15 claims
- 2384US6203604B1Ink, color filter, liquid crystal panel, and computer, and process for producing color filterCANON KK·Filed 1999·Granted Mar 20, 2001·64 cites·32 claims
- 2483US7981528B2Magnetic sheet with stripe-arranged magnetic grains, RFID magnetic sheet, magnetic shielding sheet and method of manufacturing the samePANASONIC CORP·Filed 2007·Granted Jul 19, 2011·12 cites·29 claims
- 2583US7759162B2Flip chip mounting process and flip chip assemblyPANASONIC CORP·Filed 2005·Granted Jul 20, 2010·10 cites·3 claims
- 2681US8283246B2Flip chip mounting method and bump forming methodKITAE TAKASHI·Filed 2011·Granted Oct 9, 2012·4 cites·7 claims
- 2781US6248482B1Ink, color filter, liquid crystal panel, and computer, and process for producing color filterCANON KK·Filed 1999·Granted Jun 19, 2001·40 cites·37 claims
- 2880US6936774B2Wiring substrate produced by transfer material methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Aug 30, 2005·17 cites·15 claims
- 2979US7560236B2Microbial community analysisKAO CORP·Filed 2007·Granted Jul 14, 2009·1 cites·9 claims
- 3078US9330811B2Transparent electrode and method for manufacturing the samePANASONIC IP MAN CO LTD·Filed 2013·Granted May 3, 2016·2 cites·25 claims
- 3178US7531754B2Flexible substrate having interlaminar junctions, and process for producing the samePANASONIC CORP·Filed 2007·Granted May 12, 2009·6 cites·11 claims
- 3277US8288778B2Semiconductor device having semiconductor elements formed inside a resin film substrateNAKATANI SEIICHI·Filed 2008·Granted Oct 16, 2012·4 cites·23 claims
- 3376US9956761B2Ink, ink cartridge, and ink jet recording methodCANON KK·Filed 2016·Granted May 1, 2018·1 cites·17 claims
- 3476US7951700B2Flip chip mounting method and bump forming methodPANASONIC CORP·Filed 2006·Granted May 31, 2011·5 cites·9 claims
- 3576US7713787B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted May 11, 2010·4 cites·10 claims
- 3676US7314276B2Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatusCANON KK·Filed 2004·Granted Jan 1, 2008·8 cites·11 claims
- 3775US12421407B2Aqueous ink, ink cartridge and ink jet recording methodCANON KK·Filed 2022·Granted Sep 23, 2025·0 cites·19 claims
- 3874US6692818B2Method for manufacturing circuit board and circuit board and power conversion module using the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Granted Feb 17, 2004·17 cites·7 claims
- 3973US7321496B2Flexible substrate, multilayer flexible substrate and process for producing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2005·Granted Jan 22, 2008·3 cites·15 claims
- 4073US7041535B2Power module and method of manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted May 9, 2006·16 cites·12 claims
- 4172US9236338B2Built-up substrate, method for manufacturing same, and semiconductor integrated circuit packagePANASONIC CORP·Filed 2012·Granted Jan 12, 2016·2 cites·20 claims
- 4272US8039307B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2010·Granted Oct 18, 2011·2 cites·19 claims
- 4370US7888789B2Transfer material used for producing a wiring substratePANASONIC CORP·Filed 2005·Granted Feb 15, 2011·2 cites·13 claims
- 4469US7911064B2Mounted body and method for manufacturing the samePANASONIC CORP·Filed 2006·Granted Mar 22, 2011·4 cites·13 claims
- 4569US7875496B2Flip chip mounting method, flip chip mounting apparatus and flip chip mounting bodyPANASONIC CORP·Filed 2006·Granted Jan 25, 2011·5 cites·12 claims
- 4669US6930395B2Circuit substrate having improved connection reliability and a method for manufacturing the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2001·Granted Aug 16, 2005·13 cites·10 claims
- 4768US9449944B2Electronic component package and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Sep 20, 2016·2 cites·9 claims
- 4868US7731346B2Ink-jet recording method, ink-jet ink, ink-jet recording unit, ink cartridge for ink-jet recording and ink-jet recording apparatusCANON KK·Filed 2007·Granted Jun 8, 2010·2 cites·23 claims
- 4967US9595651B2Electronic component package and method for manufacturing samePANASONIC IP MAN CO LTD·Filed 2013·Granted Mar 14, 2017·2 cites·13 claims
- 5067US6787884B2Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module productionMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Sep 7, 2004·12 cites·38 claims
Showing the top 50 of 98 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Yoshihisa Yamashita files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →