Inventor · disambiguated record

Philippe Calvel

Also filed as: CALVEL PHILIPPE

1 granted patent·2 citations·filing 2000–2000

19Inventor score

Technology areasH10W

Files withCIT ALCATEL1

Top patents by PatentIndex Score

1 record

0135US6683373B1Method of modifying connecting leads and thinning bases of encapsulated modular electronic components to obtain a high-density module, and a module obtained therebyCIT ALCATEL·Filed 2000·Granted Jan 27, 2004·2 cites·15 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →