Inventor · disambiguated record
Faxing Che
Also filed as: CHE FAXING
4 granted patents·10 pending applications·3 citations·filing 2009–2025
60Inventor score
Top patents by PatentIndex Score
14 records- 0175US2025349748A1Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0270US2025336737A1Semiconductor devices with flexible spacerMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 0369US12368113B2Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 22, 2025·0 cites·20 claims
- 0468US9012269B2Reducing warpage for fan-out wafer level packagingJIN YONGGANG·Filed 2012·Granted Apr 21, 2015·3 cites·11 claims
- 0566US12362247B2Semiconductor devices with flexible spacer including a support structure and methods of making the sameMICRON TECHNOLOGY INC·Filed 2022·Granted Jul 15, 2025·0 cites·17 claims
- 0662US12506134B2Fan-out packaging for a multichip packageMICRON TECHNOLOGY INC·Filed 2022·Granted Dec 23, 2025·0 cites·24 claims
- 0759US2025149416A1Semiconductor assemblies with wire-bonded traces, and methods for making the sameMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0859US2025132240A1Package with back-to-back die stackingMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0956US2025096046A1Structure for testing interfacial adhesion between mold compound and vertical edges of a semiconductor dieMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1053US2024274580A1Terraced support structure to mitigate stacked die overhang deflectionMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1148US2024038704A1Hybrid semiconductor device assembly interconnection pillars and associated methodsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1246US2024063141A1Solder joint design for improved package reliabilityMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 1346US2010167471A1Reducing warpage for fan-out wafer level packagingST MICROELECTRONICS ASIA·Filed 2009·Application pending·0 cites
- 1434US2013001795A1Wafer Level Package and a Method of Forming the SameAGENCY SCIENCE TECH & RES·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Faxing Che files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →