Inventor · disambiguated record
Eunchul Ahn
Also filed as: AHN EUNCHUL
7 granted patents·7 pending applications·21 citations·filing 2009–2015
78Inventor score
Top patents by PatentIndex Score
14 records- 0180US8053881B2Semiconductor package and method for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·10 cites·5 claims
- 0274US8558400B2Semiconductor packages and methods of fabricating the samePARK JIN-WOO·Filed 2011·Granted Oct 15, 2013·4 cites·15 claims
- 0372US8815731B2Semiconductor package and method of fabricating the sameKIM YOUNG LYONG·Filed 2011·Granted Aug 26, 2014·5 cites·18 claims
- 0467US9035308B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted May 19, 2015·2 cites·20 claims
- 0551US8759221B2Package substrates, semiconductor packages having the same, and methods of fabricating the semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 24, 2014·0 cites·9 claims
- 0648US2014151863A1Semiconductor packages and methods of fabricating the sameKIM SANG-UK·Filed 2013·Application pending·0 cites
- 0747US8497569B2Package substrates and semiconductor packages having the samePARK JIN-WOO·Filed 2011·Granted Jul 30, 2013·0 cites·27 claims
- 0846US2010096754A1Semiconductor package, semiconductor module, and method for fabricating the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2009·Application pending·0 cites
- 0943US2015270242A1Semiconductor packages and methods of fabricating the sameKIM SANG-UK·Filed 2015·Application pending·0 cites
- 1039US2013178016A1Methods of fabricating a package-on-package device and package-on-package devices fabricated by the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 1137US8491982B2Apparatus for manufacturing bonding structure, bonding structure and method of fabricating the sameAHN EUNCHUL·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
- 1232US2010190333A1Method of forming connection terminalSAMSUNG ELECTRONICS CO LTD·Filed 2010·Application pending·0 cites
- 1330US2012031953A1Apparatus for bump reflow and methods of forming bumps using the samePARK MYEONG SOON·Filed 2011·Application pending·0 cites
- 1428US2016148888A1Semiconductor devices and methods for fabricating the sameRYU SEUNG-KWAN·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →