Inventor · disambiguated record
Kuo-Feng Peng
Also filed as: PENG KUO-FENG
3 granted patents·14 pending applications·127 citations·filing 2001–2012
75Inventor score
Top patents by PatentIndex Score
17 records- 0190US6441496B1Structure of stacked integrated circuitsFiled 2001·Granted Aug 27, 2002·84 cites·6 claims
- 0280US6646316B2Package structure of an image sensor and packagingKINGPAK TECH INC·Filed 2001·Granted Nov 11, 2003·35 cites·2 claims
- 0356US6489572B2Substrate structure for an integrated circuit package and method for manufacturing the sameKINGPAK TECH INC·Filed 2001·Granted Dec 3, 2002·8 cites·12 claims
- 0438US2006083044A1MMC memory card with TSOP packageCHEN CHI H·Filed 2004·Application pending·0 cites
- 0535US2013113369A1Led package moduleKU SHU MEI·Filed 2012·Application pending·0 cites
- 0635US2006082986A1Housing for memory cardCHEN CHI H·Filed 2004·Application pending·0 cites
- 0735US2013113001A1Led package moduleSHU MEI KU·Filed 2012·Application pending·0 cites
- 0833US2002096782A1Package structure of an image sensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 0933US2002060287A1Structure of a photosensor and method for packaging the sameFiled 2001·Application pending·0 cites
- 1033US2006090334A1Processes for packing memory cards by single moldCHEN CHI H·Filed 2004·Application pending·0 cites
- 1132US2005093119A1Window type case for memory cardABOUNION TECHNOLOGY CORP·Filed 2003·Application pending·0 cites
- 1232US2002043709A1Stackable integrated circuitFiled 2001·Application pending·0 cites
- 1331US2002096751A1Integrated circuit structure having an adhesive agent and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 1430US2002096766A1Package structure of integrated circuits and method for packaging the sameFiled 2001·Application pending·0 cites
- 1528US2002096754A1Stacked structure of integrated circuitsFiled 2001·Application pending·0 cites
- 1626US2002096761A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 1726US2002096762A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →