Inventor · disambiguated record
Vern H. Winchell, Ii
Also filed as: WINCHELL II VERN H
6 granted patents·224 citations·filing 1979–1993
85Inventor score
Files withMOTOROLA INC6
Top patents by PatentIndex Score
6 records- 0194US4630096AHigh density IC module assemblyMOTOROLA INC·Filed 1984·Granted Dec 16, 1986·118 cites·11 claims
- 0282US4722914AMethod of making a high density IC module assemblyMOTOROLA INC·Filed 1986·Granted Feb 2, 1988·63 cites·12 claims
- 0353US4394678AElevated edge-protected bonding pedestals for semiconductor devicesMOTOROLA INC·Filed 1979·Granted Jul 19, 1983·15 cites·9 claims
- 0440US5164885AElectronic package having a non-oxide ceramic bonded to metal and method for makingMOTOROLA INC·Filed 1991·Granted Nov 17, 1992·11 cites·15 claims
- 0534US5886362AMethod of reflowing solder bumps after probe testMOTOROLA INC·Filed 1993·Granted Mar 23, 1999·12 cites·16 claims
- 0632US4609936ASemiconductor chip with direct-bonded external leadframeMOTOROLA INC·Filed 1979·Granted Sep 2, 1986·5 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →