Inventor · disambiguated record
Longqiang Zu
Also filed as: ZU LONGQIANG · ZU LONGQIANG L
10 granted patents·136 citations·filing 1999–2018
89Inventor score
Top patents by PatentIndex Score
10 records- 0189US10410984B1Package substrate differential impedance optimization for 25 to 60 GBPS and beyondSARCINA TECH LLC·Filed 2018·Granted Sep 10, 2019·13 cites·11 claims
- 0289US9666544B2Package substrate differential impedance optimization for 25 GBPS and beyondSARCINA TECH LLC·Filed 2015·Granted May 30, 2017·15 cites·15 claims
- 0384US6594153B1Circuit package for electronic systemsINTEL CORP·Filed 2000·Granted Jul 15, 2003·35 cites·13 claims
- 0479US8152048B2Method and structure for adapting solder column to warped substrateZU LONGQIANG·Filed 2008·Granted Apr 10, 2012·10 cites·9 claims
- 0563US8247909B2Semiconductor package device with cavity structure and the packaging method thereofZU LONGQIANG·Filed 2011·Granted Aug 21, 2012·2 cites·18 claims
- 0662US6879494B2Circuit package for electronic systemsINTEL CORP·Filed 2003·Granted Apr 12, 2005·9 cites·14 claims
- 0762US6303871B1Degassing hole design for olga trace impedanceINTEL CORP·Filed 1999·Granted Oct 16, 2001·28 cites·30 claims
- 0859US6177732B1Multi-layer organic land grid array to minimize via inductanceINTEL CORP·Filed 1999·Granted Jan 23, 2001·24 cites·15 claims
- 0936US8278145B2Method for packaging semiconductor deviceCHEN CHIEN-WEN·Filed 2011·Granted Oct 2, 2012·0 cites·17 claims
- 1032US10276519B2Package substrate differential impedance optimization for 25 to 60 Gbps and beyondSARCINA TECH LLC·Filed 2017·Granted Apr 30, 2019·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →