Inventor · disambiguated record
David R. Motschman
Also filed as: MOTSCHMAN DAVID · MOTSCHMAN DAVID R · MOTSCHMAN DAVID ROY
12 granted patents·3 pending applications·238 citations·filing 1989–2016
91Inventor score
Top patents by PatentIndex Score
15 records- 0197US8299608B2Enhanced thermal management of 3-D stacked die packagingBARTLEY GERALD K·Filed 2010·Granted Oct 30, 2012·60 cites·23 claims
- 0291US6890206B2Optical transceiver latchJDS UNIPHASE CORP·Filed 2003·Granted May 10, 2005·58 cites·18 claims
- 0390US9245813B2Horizontally aligned graphite nanofibers in etched silicon wafer troughs for enhanced thermal performanceIBM·Filed 2013·Granted Jan 26, 2016·13 cites·13 claims
- 0487US5027254AApparatus for cooling electronics componentsIBM·Filed 1989·Granted Jun 25, 1991·69 cites·12 claims
- 0583US8139355B2Memory module connector having memory module cooling structuresMOTSCHMAN DAVID R·Filed 2010·Granted Mar 20, 2012·10 cites·13 claims
- 0682US9609785B1Air-cooled heatsink for cooling integrated circuitsIBM·Filed 2016·Granted Mar 28, 2017·4 cites·17 claims
- 0781US9111899B2Horizontally and vertically aligned graphite nanofibers thermal interface material for use in chip stacksBARTLEY GERALD K·Filed 2012·Granted Aug 18, 2015·5 cites·13 claims
- 0879US8367478B2Method and system for internal layer-layer thermal enhancementIBM·Filed 2011·Granted Feb 5, 2013·5 cites·20 claims
- 0978US9655287B1Heat exchangers for cooling integrated circuitsIBM·Filed 2016·Granted May 16, 2017·3 cites·17 claims
- 1072US8489217B2Thermal cycling and gradient management in three-dimensional stacked architecturesCHER CHEN-YONG·Filed 2011·Granted Jul 16, 2013·3 cites·21 claims
- 1161US6652159B2Enhanced optical transceiver arrangementIBM·Filed 2001·Granted Nov 25, 2003·7 cites·33 claims
- 1258US7551444B2Method and computer system with anti-tamper capability and thermal packaging structure for implementing enhanced heat removal from processor circuitryIBM·Filed 2007·Granted Jun 23, 2009·1 cites·20 claims
- 1349US2009284931A1Nested fin integral heat sink assembly for multiple high power electonic circuit board modulesIBM·Filed 2008·Application pending·0 cites
- 1442US2009213541A1Cooling Plate Assembly with Fixed and Articulated Interfaces, and Method for Producing SameBUTTERBAUGH MATTHEW ALLEN·Filed 2008·Application pending·0 cites
- 1540US2009147827A1Methods, Systems, and Computer Program Products for Implementing Spread Spectrum Using Digital Signal Processing TechniquesHOLMQUIST RICHARD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →