Inventor · disambiguated record
Patrick Carberry
Also filed as: CARBERRY PATRICK J · CARBERRY PATRICK JOSEPH
7 granted patents·3 pending applications·82 citations·filing 2003–2008
82Inventor score
Top patents by PatentIndex Score
10 records- 0190US7224047B2Semiconductor device package with reduced leakageLSI CORP·Filed 2004·Granted May 29, 2007·62 cites·20 claims
- 0272US7541669B2Semiconductor device package with base features to reduce leakageAGERE SYSTEMS INC·Filed 2007·Granted Jun 2, 2009·5 cites·16 claims
- 0362US7960812B2Electrical devices having adjustable capacitanceAGERE SYSTEMS INC·Filed 2008·Granted Jun 14, 2011·2 cites·14 claims
- 0457US7009305B2Methods and apparatus for integrated circuit ball bonding using stacked ball bumpsAGERE SYSTEMS INC·Filed 2004·Granted Mar 7, 2006·9 cites·22 claims
- 0547US7956451B2Packages for encapsulated semiconductor devices and method of making sameAGERE SYSTEMS INC·Filed 2004·Granted Jun 7, 2011·4 cites·20 claims
- 0640US7456716B2Electrical devices having adjustable electrical characteristicsAGERE SYSTEMS INC·Filed 2003·Granted Nov 25, 2008·0 cites·4 claims
- 0738US2006170079A1Integrated circuit device having encapsulant dam with chamfered edgeBRENNAN JOHN M·Filed 2005·Application pending·0 cites
- 0837US2006145317A1Leadframe designs for plastic cavity transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
- 0934US2004212081A1Process for fabricating a power hybrid moduleFiled 2003·Application pending·0 cites
- 1029US7314781B2Device packages having stable wirebondsLSI CORP·Filed 2003·Granted Jan 1, 2008·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →