Inventor · disambiguated record
Yasuji Hiramatsu
Also filed as: HIRAMATSU YASUJI
55 granted patents·42 pending applications·1,461 citations·filing 1987–2012
99Inventor score
Top patents by PatentIndex Score
97 records- 0197US6507006B1Ceramic substrate and process for producing the sameIBIDEN CO LTD·Filed 2000·Granted Jan 14, 2003·137 cites·18 claims
- 0297US6465763B1Ceramic heaterIBIDEN CO LTD·Filed 2000·Granted Oct 15, 2002·112 cites·10 claims
- 0395US6929874B2Aluminum nitride sintered body, ceramic substrate, ceramic heater and electrostatic chuckIBIDEN CO LTD·Filed 2003·Granted Aug 16, 2005·69 cites·13 claims
- 0494US7361849B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Apr 22, 2008·16 cites·6 claims
- 0594US6891263B2Ceramic substrate for a semiconductor production/inspection deviceIBIDEN CO LTD·Filed 2001·Granted May 10, 2005·65 cites·14 claims
- 0694US6677557B2Ceramic heaterIBIDEN CO LTD·Filed 2001·Granted Jan 13, 2004·64 cites·21 claims
- 0792US6835895B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1997·Granted Dec 28, 2004·48 cites·29 claims
- 0891US6609297B1Method of manufacturing multilayer printed wiring boardIBIDEN CO LTD·Filed 1998·Granted Aug 26, 2003·59 cites·8 claims
- 0991US6010768AMultilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1997·Granted Jan 4, 2000·74 cites·15 claims
- 1090US6731496B2Electrostatic chuckIBIDEN CO LTD·Filed 2001·Granted May 4, 2004·42 cites·16 claims
- 1190US6710307B2Ceramic heaterIBIDEN CO LTD·Filed 2002·Granted Mar 23, 2004·35 cites·9 claims
- 1289US6251502B1Multilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1999·Granted Jun 26, 2001·58 cites·9 claims
- 1388US7462802B2Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Dec 9, 2008·12 cites·9 claims
- 1488US7456372B2Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring boardIBIDEN CO LTD·Filed 2004·Granted Nov 25, 2008·34 cites·19 claims
- 1588US7071551B2Device used to produce or examine semiconductorsIBIDEN CO LTD·Filed 2001·Granted Jul 4, 2006·34 cites·10 claims
- 1687US6753601B2Ceramic substrate for semiconductor fabricating deviceIBIDEN CO LTD·Filed 2001·Granted Jun 22, 2004·31 cites·16 claims
- 1787US6242079B1Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1998·Granted Jun 5, 2001·67 cites·16 claims
- 1885US7385146B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Jun 10, 2008·6 cites·14 claims
- 1985US6960743B2Ceramic substrate for semiconductor manufacturing, and method of manufacturing the ceramic substrateIBIDEN CO LTD·Filed 2001·Granted Nov 1, 2005·32 cites·6 claims
- 2085US6815646B2Ceramic substrate for semiconductor manufacture/inspection apparatus, ceramic heater, electrostatic clampless holder, and substrate for wafer proberIBIDEN CO LTD·Filed 2001·Granted Nov 9, 2004·26 cites·10 claims
- 2184US6964812B2Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductorIBIDEN CO LTD·Filed 2003·Granted Nov 15, 2005·20 cites·7 claims
- 2283US6586686B1Multilayer printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 1999·Granted Jul 1, 2003·34 cites·31 claims
- 2381US7721427B2Method for manufacturing single sided substrateIBIDEN CO LTD·Filed 2005·Granted May 25, 2010·6 cites·13 claims
- 2480US7375289B2Multi-layer printed wiring board including an alignment mark as an index for a position of via holesIBIDEN CO LTD·Filed 2006·Granted May 20, 2008·6 cites·18 claims
- 2580US6888106B2Ceramic heaterIBIDEN CO LTD·Filed 2001·Granted May 3, 2005·19 cites·12 claims
- 2680US6217988B1Multilayer printed circuit board, method of producing multilayer printed circuit board and resin fillerIBIDEN CO LTD·Filed 1999·Granted Apr 17, 2001·38 cites·12 claims
- 2779US6900149B1Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductorIBIDEN CO LTD·Filed 2000·Granted May 31, 2005·15 cites·7 claims
- 2877US7127812B2Process for producing a multi-layer printed wiring boardIBIDEN CO LTD·Filed 2003·Granted Oct 31, 2006·15 cites·30 claims
- 2977US7084376B2Semiconductor production device ceramic plateIBIDEN CO LTD·Filed 2003·Granted Aug 1, 2006·13 cites·21 claims
- 3077US6717116B1Semiconductor production device ceramic plateIBIDEN CO LTD·Filed 1999·Granted Apr 6, 2004·35 cites·34 claims
- 3176US7667160B2Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring boardIBIDEN CO LTD·Filed 2006·Granted Feb 23, 2010·3 cites·9 claims
- 3276US7615162B2Printed wiring board and method for manufacturing the sameIBIDEN CO LTD·Filed 2006·Granted Nov 10, 2009·3 cites·9 claims
- 3376US6878907B2Ceramic substrate and process for producing the sameIBIDEN CO LTD·Filed 2002·Granted Apr 12, 2005·12 cites·15 claims
- 3476US6835916B2Ceramic heaterIBIDEN CO LTD·Filed 2002·Granted Dec 28, 2004·17 cites·7 claims
- 3576US6809299B2Hot plate for semiconductor manufacture and testingIBIDEN CO LTD·Filed 2001·Granted Oct 26, 2004·15 cites·14 claims
- 3675US7078655B1Ceramic substrate, ceramic heater, electrostatic chuck and wafer prober for use in semiconductor producing and inspecting devicesIBIDEN CO LTD·Filed 2000·Granted Jul 18, 2006·14 cites·10 claims
- 3775US7015166B2Carbon-containing aluminum nitride sintered compact and ceramic substrate for use in equipment for manufacturing or inspecting semiconductorIBIDEN CO LTD·Filed 2004·Granted Mar 21, 2006·11 cites·2 claims
- 3875US6956186B1Ceramic heaterIBIDEN CO LTD·Filed 2000·Granted Oct 18, 2005·17 cites·18 claims
- 3975US6518513B1Single-sided circuit board and method for manufacturing the sameIBIDEN CO LTD·Filed 1999·Granted Feb 11, 2003·25 cites·23 claims
- 4073US6861165B2Aluminum nitride sintered compact, ceramic substrate, ceramic heater and electrostatic chuckIBIDEN CO LTD·Filed 2001·Granted Mar 1, 2005·11 cites·32 claims
- 4172US7011874B2Ceramic substrate for semiconductor production and inspection devicesIBIDEN CO LTD·Filed 2001·Granted Mar 14, 2006·14 cites·10 claims
- 4270US6825555B2Hot plateIBIDEN CO LTD·Filed 2001·Granted Nov 30, 2004·10 cites·10 claims
- 4367US7732732B2Laser machining apparatus, and apparatus and method for manufacturing a multilayered printed wiring boardIBIDEN CO LTD·Filed 2004·Granted Jun 8, 2010·9 cites·14 claims
- 4467US6887316B2Ceramic heaterIBIDEN CO LTD·Filed 2001·Granted May 3, 2005·10 cites·5 claims
- 4565US6888236B2Ceramic substrate for manufacture/inspection of semiconductorIBIDEN CO LTD·Filed 2001·Granted May 3, 2005·10 cites·26 claims
- 4665US4869516ASteel laminate gasketsISHIKAWA GASKET·Filed 1987·Granted Sep 26, 1989·23 cites·7 claims
- 4764US8614898B2Printed wiring board, electronic device, and printed wiring board manufacturing methodHIRAMATSU YASUJI·Filed 2011·Granted Dec 24, 2013·2 cites·50 claims
- 4864US6936343B1Ceramic substrateIBIDEN CO LTD·Filed 2000·Granted Aug 30, 2005·7 cites·10 claims
- 4959US6861620B2Ceramic heaterIBIDEN CO LTD·Filed 2003·Granted Mar 1, 2005·4 cites·12 claims
- 5057US7761984B2Process for producing multi-layer printed wiring boardIBIDEN CO LTD·Filed 2008·Granted Jul 27, 2010·0 cites·20 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →