Assignee
HIRAMATSU YASUJI
JP·1 granted patent·1 pending application·2 citations·filing 2011–2012
Top patents by PatentIndex Score
2 records- 0164US8614898B2Printed wiring board, electronic device, and printed wiring board manufacturing methodHIRAMATSU YASUJI·Filed 2011·Granted Dec 24, 2013·2 cites·50 claims
- 0231US2012181560A1Led wiring board, light emitting module, method for manufacturing led wiring board and method for manufacturing light emitting moduleHIRAMATSU YASUJI·Filed 2012·Application pending·0 cites
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