Inventor · disambiguated record
Byungjo Kim
Also filed as: KIM BYUNGJO
4 granted patents·1 pending application·0 citations·filing 2020–2023
56Inventor score
Files withSAMSUNG ELECTRONICS CO LTD5
Top patents by PatentIndex Score
5 records- 0168US11848301B2Method of manufacturing a semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 19, 2023·0 cites·20 claims
- 0267US11869751B2Upper electrode and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·20 claims
- 0365US11545344B2Upper electrode and substrate processing apparatus including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 3, 2023·0 cites·19 claims
- 0460US11626381B2Bonding head including a thermal compensator, die bonding apparatus including the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Apr 11, 2023·0 cites·20 claims
- 0557US2024192604A1Post baking apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →