Inventor · disambiguated record
Mahadevan Suryakumar
Also filed as: SURYAKUMAR MAHADEVAN
3 granted patents·7 pending applications·14 citations·filing 2003–2023
61Inventor score
Top patents by PatentIndex Score
10 records- 0180US8227706B2Coaxial plated through holes (PTH) for robust electrical performanceROY MIHIR·Filed 2008·Granted Jul 24, 2012·12 cites·10 claims
- 0260US2010073894A1Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating sameMORTENSEN RUSSELL·Filed 2008·Application pending·0 cites
- 0352US2012005887A1Coreless substrate, method of manufacturing same, and package for microelectronic device incorporating sameMORTENSEN RUSSELL·Filed 2011·Application pending·0 cites
- 0450US2025372585A1Integrated system in packageADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0548US2013189812A1Coaxial plated through holes (pth) for robust electrical performanceROY MIHIR·Filed 2012·Application pending·0 cites
- 0644US2011318850A1Microelectronic package and method of manufacturing sameGUZEK JOHN S·Filed 2011·Application pending·0 cites
- 0742US7152313B2Package substrate for integrated circuit and method of making the substrateINTEL CORP·Filed 2003·Granted Dec 26, 2006·2 cites·8 claims
- 0837US2008157313A1Array capacitor for decoupling multiple voltagesDATTAGURU SRIRAM·Filed 2006·Application pending·0 cites
- 0934US7586192B2Routing configuration for high frequency signals in an integrated circuit packageINTEL CORP·Filed 2005·Granted Sep 8, 2009·0 cites·18 claims
- 1031US2007231951A1Reducing layer count in semiconductor packagesSURYAKUMAR MAHADEVAN·Filed 2006·Application pending·0 cites
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