Inventor · disambiguated record
Takahiro Takano
Also filed as: TAKANO TAKAHIRO
23 granted patents·13 pending applications·151 citations·filing 2001–2021
94Inventor score
Files withNITTO DENKO CORP12MITSUBISHI ENG PLASTICS CORP7SUMITOMO METAL IND4MITADERA JUN3MITSUBISHI ENGINEERING-PLASTICS CORP3
Top patents by PatentIndex Score
36 records- 0193US7666266B2Surface conditioning prior to chemical conversion treatment of a steel memberSUMITOMO METAL IND·Filed 2006·Granted Feb 23, 2010·86 cites·1 claims
- 0290US8038179B2Threaded joint for steel pipesSUMITOMO METAL IND·Filed 2010·Granted Oct 18, 2011·13 cites·20 claims
- 0389US8603600B2Polyamide resin compositionsMITADERA JUN·Filed 2011·Granted Dec 10, 2013·7 cites·20 claims
- 0487US10988615B2Polyamide resin composition and molded articleMITSUBISHI ENG PLASTICS CORP·Filed 2017·Granted Apr 27, 2021·2 cites·16 claims
- 0584US8933161B2Thermoplastic resin composition, resin molded article, and method of manufacturing resin molded article with plated layerTAKANO TAKAHIRO·Filed 2012·Granted Jan 13, 2015·6 cites·21 claims
- 0682US9587316B2Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layerMITSUBISHI ENGINEERING-PLASTICS CORP·Filed 2013·Granted Mar 7, 2017·3 cites·20 claims
- 0781US9365693B2Thermoplastic resin composition, resin article, and method of manufacturing resin article with plated layerMITSUBISHI ENG PLASTICS CORP·Filed 2013·Granted Jun 14, 2016·5 cites·24 claims
- 0878US9096714B2Thin-wall articleMITADERA JUN·Filed 2012·Granted Aug 4, 2015·2 cites·18 claims
- 0974US10034388B2Suspension board with circuit and producing method thereofNITTO DENKO CORP·Filed 2017·Granted Jul 24, 2018·2 cites·3 claims
- 1072US10148006B2Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layerMITSUBISHI ENG PLASTICS CORP·Filed 2013·Granted Dec 4, 2018·1 cites·15 claims
- 1172US9334365B2Polyamide resin moldingsMITADERA JUN·Filed 2011·Granted May 10, 2016·1 cites·10 claims
- 1268US7469721B2Thread protector for a pipeSUMITOMO METAL IND·Filed 2004·Granted Dec 30, 2008·15 cites·21 claims
- 1366US11266024B2Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2021·Granted Mar 1, 2022·0 cites·3 claims
- 1464US2015080516A1Polyamide resin composition for portable electronic device and molded article for portable electronic deviceMITSUBISHI ENG PLASTICS CORP·Filed 2014·Application pending·0 cites
- 1559US6444739B1Polyamide resin compositionMITSUBISHI GAS CHEMICAL CO·Filed 2001·Granted Sep 3, 2002·4 cites·24 claims
- 1656US10815377B2Resin composition, resin molding, method for manufacturing plated resin molding, and method for manufacturing antenna-equipped portable electronic device partMITSUBISHI ENG PLASTICS CORP·Filed 2016·Granted Oct 27, 2020·0 cites·17 claims
- 1756US2016135296A1Wired circuit board and producing method thereof, and wired circuit board assembly and producing method thereofNITTO DENKO CORP·Filed 2015·Application pending·0 cites
- 1855US11032913B2Wired circuit board and production method thereofNITTO DENKO CORP·Filed 2017·Granted Jun 8, 2021·0 cites·4 claims
- 1955US2010227122A1Polyamide Resin Composition for Portable Electronic Device and Molded Article for Portable Electronic DeviceKUMAZAWA TERUHISA·Filed 2006·Application pending·0 cites
- 2053US10619031B2Crystallizable thermoplastic resin composition and molded articleMITSUBISHI ENG PLASTICS CORP·Filed 2014·Granted Apr 14, 2020·0 cites·8 claims
- 2153US2017318676A1Wired circuit board and producing method thereof, and wired circuit board assembly and producing method thereofNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 2253US2016298242A1Processes for manufacturing resin molded articlesMITSUBISHI ENGINEERING-PLASTICS CORP·Filed 2014·Application pending·0 cites
- 2352US11337302B2Wiring circuit boardNITTO DENKO CORP·Filed 2018·Granted May 17, 2022·0 cites·5 claims
- 2451US11369024B2Producing method of wiring circuit board and wiring circuit board assembly sheetNITTO DENKO CORP·Filed 2020·Granted Jun 21, 2022·0 cites·2 claims
- 2551US7244471B2Method for surface treatment of metal pipesSUMITOMO METAL IND·Filed 2004·Granted Jul 17, 2007·1 cites·16 claims
- 2650US2016215124A1Thermoplastic resin composition, resin molded article, and method for manufacturing the resin molded article with plating layerMITSUBISHI ENGINEERING-PLASTICS CORP·Filed 2014·Application pending·0 cites
- 2749US2015353714A1Thermoplastic resin composition, resin molded article, and method for manufacturing resin molded article having a plated layerMITSUBISHI ENG PLASTICS CORP·Filed 2013·Application pending·0 cites
- 2849US2020276312A1Elimination of chronic pain by chronic activation of adenosine receptor type A1 in peripheral sensory neuronsUNIV ROCHESTER·Filed 2020·Application pending·0 cites
- 2945US6784387B2Interlock deviceNEC CORP·Filed 2002·Granted Aug 31, 2004·3 cites·18 claims
- 3042US12144125B2Pressure-sensitive adhesive sheet-including wiring circuit board and producing method thereofNITTO DENKO CORP·Filed 2020·Granted Nov 12, 2024·0 cites·5 claims
- 3142US2010029613A1Treatment and prevention of epilepsyUNIV ROCHESTER·Filed 2005·Application pending·0 cites
- 3240US11081437B2Imaging element mounting board, producing method of imaging element mounting board, and mounting board assemblyNITTO DENKO CORP·Filed 2018·Granted Aug 3, 2021·0 cites·14 claims
- 3339US2007006946A1Manufacturing method of martensite stainless seamless steel pipeTAKANO TAKAHIRO·Filed 2006·Application pending·0 cites
- 3437US2017330590A1Suspension board with circuit and producing method thereofNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3536US2017229635A1Wired circuit boardNITTO DENKO CORP·Filed 2017·Application pending·0 cites
- 3634US2021195757A1Producing method of wiring circuit board and wiring circuit board sheetNITTO DENKO CORP·Filed 2020·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →