Inventor · disambiguated record
Hidetsugu Motobe
Also filed as: MOTOBE HIDETSUGU
6 granted patents·1 pending application·8 citations·filing 1999–2016
71Inventor score
Top patents by PatentIndex Score
7 records- 0152US7566501B2Resin composition for printed wiring board, prepreg, laminate, and printed wiring board made with the sameMATSUSHITA ELECTRIC WORKS LTD·Filed 2004·Granted Jul 28, 2009·1 cites·11 claims
- 0247US9681541B2Resin composition, prepreg, metal foil with resin, metal-clad laminated plate, and printed wiring boardPANASONIC IP MAN CO LTD·Filed 2016·Granted Jun 13, 2017·0 cites·7 claims
- 0340US10450405B2Resin composition, prepreg, metal foil with resin, metal-clad laminate, printed wiring boardPANASONIC IP MAN CO LTD·Filed 2015·Granted Oct 22, 2019·0 cites·8 claims
- 0440US8062750B2Epoxy resin composition for prepreg, prepreg and multilayered printed wiring boardMOTOBE HIDETSUGU·Filed 2004·Granted Nov 22, 2011·2 cites·14 claims
- 0535US2006222856A1Prepreg for printed wiring board and copper-clad laminated boardITOU KATSUHIKO·Filed 2003·Application pending·0 cites
- 0633US8470938B2Resin composition for printed wiring board, prepreg, and laminate obtained with the sameMOTOBE HIDETSUGU·Filed 2003·Granted Jun 25, 2013·0 cites·14 claims
- 0731US6231959B1Prepreg of epoxy resin, hardener, and organodialkyurea promotorMATSUSHITA ELECTRIC WORKS LTD·Filed 1999·Granted May 15, 2001·5 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →