Inventor · disambiguated record
Fuaida Harun
Also filed as: HARUN FUAIDA · HARUN FUAIDA BTE
7 granted patents·1 pending application·136 citations·filing 2001–2008
87Inventor score
Technology areasH10W
Top patents by PatentIndex Score
8 records- 0181US6933614B2Integrated circuit die having a copper contact and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 23, 2005·31 cites·15 claims
- 0280US7042098B2Bonding pad for a packaged integrated circuitFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted May 9, 2006·33 cites·18 claims
- 0373US6854637B2Wirebonding insulated wireFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Feb 15, 2005·22 cites·23 claims
- 0469US6693020B2Method of preparing copper metallization die for wirebondingMOTOROLA INC·Filed 2001·Granted Feb 17, 2004·21 cites·13 claims
- 0566US6563226B2Bonding padMOTOROLA INC·Filed 2001·Granted May 13, 2003·14 cites·11 claims
- 0660US7261230B2Wirebonding insulated wire and capillary thereforFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Aug 28, 2007·14 cites·22 claims
- 0754US7795712B2Lead frame with non-conductive connective barINFINEON TECHNOLOGIES AG·Filed 2008·Granted Sep 14, 2010·1 cites·18 claims
- 0841US2006231959A1Bonding pad for a packaged integrated circuitHARUN FUAIDA·Filed 2006·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →