Inventor · disambiguated record
Jin Liu
Also filed as: LIU JIN · LIU JIN-YAW
8 granted patents·4 pending applications·17 citations·filing 2001–2021
79Inventor score
Top patents by PatentIndex Score
12 records- 0198US11557758B2Solvent-free dry powder process to incorporate ceramic particles into electrochemical cell componentsGM GLOBAL TECH OPERATIONS LLC·Filed 2020·Granted Jan 17, 2023·5 cites·19 claims
- 0285US12104258B2Melt spinning methods for forming lithium-metal foils and electrodes of electrochemical devicesGM GLOBAL TECH OPERATIONS LLC·Filed 2021·Granted Oct 1, 2024·1 cites·20 claims
- 0384US11165052B2Lithium alloy-based electrodes for electrochemical cells and methods for making the sameGM GLOBAL TECH OPERATIONS LLC·Filed 2019·Granted Nov 2, 2021·1 cites·16 claims
- 0482US11688843B2Calendered electrode and method of making sameGM GLOBAL TECH OPERATIONS LLC·Filed 2020·Granted Jun 27, 2023·1 cites·11 claims
- 0582US11417888B2Electrode additives and coatings for minimizing cathode transition metal dissolutionGM GLOBAL TECH OPERATIONS LLC·Filed 2019·Granted Aug 16, 2022·1 cites·10 claims
- 0665US11735725B2Ceramic coating for lithium or sodium metal electrodesGM GLOBAL TECH OPERATIONS LLC·Filed 2019·Granted Aug 22, 2023·0 cites·20 claims
- 0763US6506269B2High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframes and method of making the sameIND TECH RES INST·Filed 2001·Granted Jan 14, 2003·8 cites·6 claims
- 0860US11757082B2Method for fabricating an anode for a lithium battery cellGM GLOBAL TECH OPERATIONS LLC·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 0959US2023027323A1Electrode coating using a porous current collectorGM GLOBAL TECH OPERATIONS LLC·Filed 2021·Application pending·0 cites
- 1054US2021408536A1Electrode including a lithium-manganese-rich nickel, manganese, cobalt component and a lithium-iron-manganese phosphate componentGM GLOBAL TECH OPERATIONS LLC·Filed 2020·Application pending·0 cites
- 1138US2004108211A1Surface treatment for a wrought copper foil for use on a flexible printed circuit board (FPCB)IND TECH RES INST·Filed 2002·Application pending·0 cites
- 1235US2003155050A1High-strength and high-conductivity Cu-(Ni, Co, Fe)-Si copper alloy for use in leadframesIND TECH RES INST·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →