Inventor · disambiguated record
Andrej Lenz
Also filed as: LENZ ANDREJ
2 granted patents·2 pending applications·8 citations·filing 2004–2017
52Inventor score
Technology areasH10P
Top patents by PatentIndex Score
4 records- 0154US7790569B2Production of semiconductor substrates with buried layers by joining (bonding) semiconductor wafersX FAB SEMICONDUCTOR FOUNDRIES·Filed 2004·Granted Sep 7, 2010·7 cites·27 claims
- 0248US8449675B2Semiconductor wafer with an epitaxially deposited layer, and process for producing the semiconductor waferKRAUTBAUER RUPERT·Filed 2008·Granted May 28, 2013·1 cites·17 claims
- 0340US2006131649A1Semiconductor wafer with an epitaxially deposited layer, and process for producing the semiconductor waferSILTRONIC AG·Filed 2005·Application pending·0 cites
- 0432US2019006190A1Fz silicon and method to prepare fz siliconSILTRONIC AG·Filed 2017·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →