Inventor · disambiguated record
Scott Joseph Jewler
Also filed as: JEWLER SCOTT · JEWLER SCOTT J · JEWLER SCOTT JOSEPH
13 granted patents·744 citations·filing 1995–2021
92Inventor score
Files withBRUKER NANO INC5AMKOR TECHNOLOGY INC2GLOBALFOUNDRIES INC2MITSUBISHI SEMICONDUCTOR AM2AMKOR TECHNOLOGY1
Top patents by PatentIndex Score
13 records- 0196US11688067B2Methods and systems for detecting defects in devices using X-raysBRUKER NANO INC·Filed 2020·Granted Jun 27, 2023·5 cites·17 claims
- 0296US11042981B2Methods and systems for printed circuit board design based on automatic correctionsSVXR INC·Filed 2020·Granted Jun 22, 2021·6 cites·20 claims
- 0395US6281568B1Plastic integrated circuit device package and leadframe having partially undercut leads and die padAMKOR TECHNOLOGY INC·Filed 1998·Granted Aug 28, 2001·485 cites·35 claims
- 0494US11430118B2Methods and systems for process control based on X-ray inspectionBRUKER NANO INC·Filed 2020·Granted Aug 30, 2022·3 cites·20 claims
- 0593US11651492B2Methods and systems for manufacturing printed circuit board based on x-ray inspectionBRUKER NANO INC·Filed 2020·Granted May 16, 2023·3 cites·78 claims
- 0693US11615533B2Methods and systems for product failure prediction based on X-ray image re-examinationBRUKER NANO INC·Filed 2020·Granted Mar 28, 2023·3 cites·35 claims
- 0793US6521987B1Plastic integrated circuit device package and method for making the packageAMKOR TECHNOLOGY INC·Filed 2000·Granted Feb 18, 2003·104 cites·18 claims
- 0882US6455356B1Methods for moding a leadframe in plastic integrated circuit devicesAMKOR TECHNOLOGY·Filed 1999·Granted Sep 24, 2002·77 cites·21 claims
- 0976US5790381AIntegrated circuit package assemblyMITSUBISHI SEMICONDUCTOR AM·Filed 1997·Granted Aug 4, 1998·35 cites·18 claims
- 1067US11662479B2Methods and systems for printed circuit board design based on automatic correctionsBRUKER NANO INC·Filed 2021·Granted May 30, 2023·0 cites·20 claims
- 1161US5623395AIntegrated circuit package assemblyMITSUBISHI SEMICONDUCTOR AM·Filed 1995·Granted Apr 22, 1997·23 cites·20 claims
- 1253US10192802B2Thin film based fan out and multi die package platformGLOBALFOUNDRIES INC·Filed 2017·Granted Jan 29, 2019·0 cites·20 claims
- 1349US9786574B2Thin film based fan out and multi die package platformGLOBALFOUNDRIES INC·Filed 2015·Granted Oct 10, 2017·0 cites·11 claims
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