Inventor · disambiguated record

Wei-Te Chu

Also filed as: CHU WEI-TE

1 granted patent·11 citations·filing 2007–2007

33Inventor score

Technology areasH10W

Files withCHIPBOND TECHNOLOGY CORP1

Top patents by PatentIndex Score

1 record

0175US8050467B2Package, packaging method and substrate thereof for sliding type thin fingerprint sensorCHIPBOND TECHNOLOGY CORP·Filed 2007·Granted Nov 1, 2011·11 cites·19 claims

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