Inventor · disambiguated record
Naoya Adachi
Also filed as: ADACHI NAOYA
8 granted patents·1 pending application·91 citations·filing 1993–2007
87Inventor score
Top patents by PatentIndex Score
9 records- 0182US6329460B1Polysiloxane composition and rubber composition and resin compositionYOKOHAMA RUBBER CO LTD·Filed 2000·Granted Dec 11, 2001·21 cites·3 claims
- 0280US6936676B2One-part, room temperature moisture curable resin compositionYOKOHAMA RUBBER CO LTD·Filed 2003·Granted Aug 30, 2005·13 cites·5 claims
- 0376US6525159B1One-pack cold moisture curable resin compositionsYOKOHAMA RUBBER CO LTD·Filed 1998·Granted Feb 25, 2003·22 cites·24 claims
- 0464US6221998B1One-pack type moisture-curable compositionYOKOHAMA RUBBER CO LTD·Filed 1999·Granted Apr 24, 2001·18 cites·14 claims
- 0556US5292812AAdhesive of epoxy resin, CTBN and maleimideYOKOHAMA RUBBER CO LTD·Filed 1993·Granted Mar 8, 1994·10 cites·8 claims
- 0654US6756466B2One-part, room temperature moisture curable resin compositionYOKOHAMA RUBBER CO LTD·Filed 2002·Granted Jun 29, 2004·1 cites·7 claims
- 0748US2004192873A1One-part, room temperature moisture curable resin compositionYOKOHAMA RUBBER CO LTD·Filed 2004·Application pending·0 cites
- 0843US7508495B2Positioning stage, bump forming apparatus equipped with the positioning stage, and bump forming method performed using the positioning stageMURATA MANUFACTURING CO·Filed 2007·Granted Mar 24, 2009·0 cites·15 claims
- 0941US6476160B1One-pack composition of epoxy resin(s) with no oh groups and ketimineYOKOHAMA RUBBER CO LTD·Filed 1999·Granted Nov 5, 2002·6 cites·2 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →