Inventor · disambiguated record
Masahito Naito
Also filed as: NAITO MASAHITO
7 granted patents·1 pending application·60 citations·filing 1986–2019
83Inventor score
Files with3M INNOVATIVE PROPERTIES CO3HITACHI HEATING APPLIANCES CO LTD2DAIKIN IND LTD1MDAP CO LTD1NAITO MASAHITO1
Top patents by PatentIndex Score
8 records- 0182US7868642B2Socket for connecting ball-grid-array integrated circuit device to test circuit3M INNOVATIVE PROPERTIES CO·Filed 2010·Granted Jan 11, 2011·5 cites·4 claims
- 0274US11108174B2Stack-type wire mount wafer connector and connector assembly3M INNOVATIVE PROPERTIES CO·Filed 2019·Granted Aug 31, 2021·3 cites·9 claims
- 0366USD313919SMicrowave ovenHITACHI HEATING APPLIANCES CO LTD·Filed 1986·Granted Jan 22, 1991·12 cites·1 claims
- 0460US11974967B2Fixing device for transport sample for use in vacuum heat insulating double walled containerMDAP CO LTD·Filed 2019·Granted May 7, 2024·2 cites·5 claims
- 0558USD304281SMicrowave ovenHITACHI HEATING APPLIANCES CO LTD·Filed 1986·Granted Oct 31, 1989·9 cites·1 claims
- 0656US4812997AControl apparatus for an air conditioning systemDAIKIN IND LTD·Filed 1987·Granted Mar 14, 1989·28 cites·4 claims
- 0749US7714602B2Socket for connecting ball-grid-array integrated circuit device to test circuit3M INNOVATIVE PROPERTIES CO·Filed 2005·Granted May 11, 2010·1 cites·2 claims
- 0841US2010072587A1Ic socket having heat dissipation functionNAITO MASAHITO·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →