Inventor · disambiguated record
Andreas Schletz
Also filed as: SCHLETZ ANDREAS
7 granted patents·2 pending applications·15 citations·filing 2007–2021
74Inventor score
Top patents by PatentIndex Score
9 records- 0177US7800220B2Power electronics assembly with cooling elementECPE ENGINEERING CT FOR POWER·Filed 2007·Granted Sep 21, 2010·13 cites·10 claims
- 0266US11296054B2Power converter module and method for production thereofFRAUNHOFER GES FORSCHUNG·Filed 2018·Granted Apr 5, 2022·2 cites·22 claims
- 0354US12176146B2Power module with an integrated aluminium snubber capacitorUNIV SYDDANSK·Filed 2021·Granted Dec 24, 2024·0 cites·15 claims
- 0451US10659035B2Power module with a unipolar semiconductor component for a long service lifeFRAUNHOFER GES FORSCHUNG·Filed 2019·Granted May 19, 2020·0 cites·8 claims
- 0547US10957684B2RC-snubber element with high dielectric strengthFRAUNHOFER GES FORSCHUNG·Filed 2019·Granted Mar 23, 2021·0 cites·9 claims
- 0646US11521899B2Method for increasing the electrical functionality, and/or service life, of power electronic modulesFRAUNHOFER GES FORSCHUNG·Filed 2021·Granted Dec 6, 2022·0 cites·9 claims
- 0743US11749533B2Method of manufacturing a power semiconductor component arrangement or a power semiconductor component housingFRAUNHOFER GES FORSCHUNG·Filed 2021·Granted Sep 5, 2023·0 cites·15 claims
- 0843US2021305197A1Method for connecting components during production of power electronic modules or assembliesFRAUNHOFER GES FORSCHUNG·Filed 2021·Application pending·0 cites
- 0934US2018166413A1Electrically conductive bond between at least two electrical components at a carrier mounted with electronic and/or electrical devices, said bond being formed by a bond wireFRAUNHOFER GES FORSCHUNG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →