Inventor · disambiguated record
Mika Kimura
Also filed as: KIMURA MIKA
5 granted patents·2 pending applications·3 citations·filing 2005–2019
65Inventor score
Files withHITACHI CHEMICAL CO LTD2HORIUCHI HARUHIKO1KAO CORP1NAGAO KOJI1SHOWA DENKO MATERIALS CO LTD1
Top patents by PatentIndex Score
7 records- 0175US10808150B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2018·Granted Oct 20, 2020·3 cites·14 claims
- 0250US7874557B2Sheet processing apparatus, sheet take-out apparatus, and sheet take-out method thereofTOSHIBA KK·Filed 2009·Granted Jan 25, 2011·0 cites·8 claims
- 0345US9920227B2Resin composition, method for manufacturing semiconductor device using resin composition, and solid-state imaging elementHITACHI CHEMICAL CO LTD·Filed 2015·Granted Mar 20, 2018·0 cites·18 claims
- 0444US2007156107A1Absorbent sheet and absorbent article using the sameKAO CORP·Filed 2006·Application pending·0 cites
- 0543US8152157B2Sheet processing apparatus, sheet take-out apparatus, and sheet take-out method thereofHORIUCHI HARUHIKO·Filed 2010·Granted Apr 10, 2012·0 cites·2 claims
- 0639US2022276558A1Photosensitive resin composition, photosensitive resin film, multilayer printed wiring board, semiconductor package, and production method for multilayer printed wiring boardSHOWA DENKO MATERIALS CO LTD·Filed 2019·Application pending·0 cites
- 0738US8524308B2Processed tea leaf product obtained by extrusionNAGAO KOJI·Filed 2005·Granted Sep 3, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →