Inventor · disambiguated record
Prianka Sengupta
Also filed as: SENGUPTA PRIANKA
2 granted patents·0 citations·filing 2018–2019
23Inventor score
Files withGLOBALFOUNDRIES INC2
Top patents by PatentIndex Score
2 records- 0145US10796973B2Test structures connected with the lowest metallization levels in an interconnect structureGLOBALFOUNDRIES INC·Filed 2019·Granted Oct 6, 2020·0 cites·17 claims
- 0244US10790204B2Test structure leveraging the lowest metallization level of an interconnect structureGLOBALFOUNDRIES INC·Filed 2018·Granted Sep 29, 2020·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →