Inventor · disambiguated record
Dennis R. Pyper
Also filed as: PYPER DENNIS · PYPER DENNIS R
25 granted patents·10 pending applications·197 citations·filing 2009–2021
96Inventor score
Top patents by PatentIndex Score
35 records- 0196US8310835B2Systems and methods for providing vias through a modular componentLIN GLORIA·Filed 2010·Granted Nov 13, 2012·29 cites·22 claims
- 0293US9196958B2Antenna structures and shield layers on packaged wireless circuitsARNOLD SHAWN XAVIER·Filed 2012·Granted Nov 24, 2015·39 cites·29 claims
- 0393US9155188B2Electromagnetic interference shielding techniquesAPPLE INC·Filed 2012·Granted Oct 6, 2015·19 cites·17 claims
- 0492US10034375B2Circuit substrate with embedded heat sinkAPPLE INC·Filed 2016·Granted Jul 24, 2018·8 cites·18 claims
- 0592US8654537B2Printed circuit board with integral radio-frequency shieldsFISHER JR JOSEPH·Filed 2010·Granted Feb 18, 2014·22 cites·10 claims
- 0691US10455738B2Stacked circuit board architecture in an electronic deviceAPPLE INC·Filed 2017·Granted Oct 22, 2019·6 cites·16 claims
- 0790US10470307B2Circuit substrate with embedded heat sinkAPPLE INC·Filed 2018·Granted Nov 5, 2019·5 cites·16 claims
- 0888US9888307B2Microphone assembly having an acoustic leak pathAPPLE INC·Filed 2016·Granted Feb 6, 2018·7 cites·22 claims
- 0988US8664656B1Devices and methods for embedding semiconductors in printed circuit boardsAPPLE INC·Filed 2012·Granted Mar 4, 2014·8 cites·12 claims
- 1087US9743522B2Printed circuit board with compact groups of devicesAPPLE INC·Filed 2012·Granted Aug 22, 2017·10 cites·14 claims
- 1187US9593991B2Printed circuits with embedded strain gaugesAPPLE INC·Filed 2015·Granted Mar 14, 2017·5 cites·20 claims
- 1286US9992863B2Connector inserts and receptacle tongues formed using printed circuit boardsAPPLE INC·Filed 2014·Granted Jun 5, 2018·6 cites·20 claims
- 1386US8072764B2Multi-part substrate assemblies for low profile portable electronic devicesYEATES KYLE H·Filed 2009·Granted Dec 6, 2011·14 cites·33 claims
- 1483US10624214B2Low-profile space-efficient shielding for SIP moduleAPPLE INC·Filed 2016·Granted Apr 14, 2020·3 cites·20 claims
- 1582US9226435B2Printed circuit board with integral radio-frequency shieldsAPPLE INC·Filed 2014·Granted Dec 29, 2015·5 cites·9 claims
- 1677US10631410B2Stacked printed circuit board packagesAPPLE INC·Filed 2017·Granted Apr 21, 2020·2 cites·16 claims
- 1777US9258906B2Liquid-based pressure sensitive adhesive for grounding applicationsAPPLE INC·Filed 2013·Granted Feb 9, 2016·1 cites·14 claims
- 1875US8861217B2Systems and methods for providing vias through a modular componentAPPLE INC·Filed 2012·Granted Oct 14, 2014·2 cites·18 claims
- 1972US8879272B2Multi-part substrate assemblies for low profile portable electronic devicesYEATES KYLE H·Filed 2011·Granted Nov 4, 2014·2 cites·9 claims
- 2065US8334704B2Systems and methods for providing a system-on-a-substrateLIN GLORIA·Filed 2009·Granted Dec 18, 2012·2 cites·6 claims
- 2164US8767408B2Three dimensional passive multi-component structuresARNOLD SHAWN X·Filed 2012·Granted Jul 1, 2014·2 cites·19 claims
- 2258US12040262B2Flex board and flexible moduleAPPLE INC·Filed 2021·Granted Jul 16, 2024·0 cites·16 claims
- 2355US8809859B2Devices and methods for embedding semiconductors in printed circuit boardsAPPLE INC·Filed 2014·Granted Aug 19, 2014·0 cites·20 claims
- 2454US2013141861A1Systems and methods for providing a system-on-a-substrateAPPLE INC·Filed 2012·Application pending·0 cites
- 2550US2010246143A1Electromagnetic Interference Shielding for Compact Electronic DevicesDINH RICHARD HUNG MINH·Filed 2009·Application pending·0 cites
- 2650US2015359099A1Low area over-head connectivity solutions to sip moduleAPPLE INC·Filed 2014·Application pending·0 cites
- 2749US2015364253A1Heel fillet capacitor with noise reductionAPPLE INC·Filed 2014·Application pending·0 cites
- 2848US2011255850A1Electronic subassemblies for electronic devicesDINH RICHARD HUNG MINH·Filed 2010·Application pending·0 cites
- 2947US2013120957A1Rf shielding for electronic componentsAPPLE INC·Filed 2012·Application pending·0 cites
- 3047US2011255250A1Printed circuit board components for electronic devicesDINH RICHARD HUNG MINH·Filed 2010·Application pending·0 cites
- 3146US8942002B2Three dimensional passive multi-component structuresARNOLD SHAWN X·Filed 2012·Granted Jan 27, 2015·0 cites·14 claims
- 3246US2014008110A1Pcb manufacturing process and structureARNOLD SHAWN X·Filed 2012·Application pending·0 cites
- 3344US2013125392A1Mounting of Components Using Solder Paste FiducialsPYPER DENNIS R·Filed 2011·Application pending·0 cites
- 3438US2014055969A1Board assemblies with minimized warpage and systems and methods for making the sameVO VU THANH·Filed 2012·Application pending·0 cites
- 3534US9839133B2Low-area overhead connectivity solutions to SIP moduleAPPLE INC·Filed 2015·Granted Dec 5, 2017·0 cites·18 claims
Join the waitlist — get patent alerts
Get an alert when Dennis R. Pyper files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →