Inventor · disambiguated record
Haengcheol Choi
Also filed as: CHOI HAENGCHEOL
6 granted patents·3 pending applications·51 citations·filing 2006–2024
78Inventor score
Top patents by PatentIndex Score
9 records- 0194US8178392B2Electronic system with expansion featureCHOI HAENGCHEOL·Filed 2007·Granted May 15, 2012·45 cites·20 claims
- 0293US11735530B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Aug 22, 2023·2 cites·21 claims
- 0375US12100663B2Semiconductor device and method of integrating RF antenna interposer with semiconductor packageSTATS CHIPPAC PTE LTD·Filed 2023·Granted Sep 24, 2024·0 cites·25 claims
- 0461US8703541B2Electronic system with expansion featureCHOI HAENGCHEOL·Filed 2012·Granted Apr 22, 2014·1 cites·20 claims
- 0561US8124520B2Integrated circuit mount system with solder mask padKIM KYUNGOE·Filed 2006·Granted Feb 28, 2012·2 cites·20 claims
- 0659US8859342B2Integrated circuit packaging system with substrate mold gate and method of manufacture thereofKIM OH HAN·Filed 2011·Granted Oct 14, 2014·1 cites·10 claims
- 0752US2024355773A1Semiconductor device and a method for forming a semiconductor deviceSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 0848US2023119181A1Semiconductor Device and Method of Forming RDL Hybrid Interposer SubstrateSTATS CHIPPAC PTE LTD·Filed 2021·Application pending·0 cites
- 0939US2007268660A1Spacerless semiconductor package chip stacking systemSTATS CHIPPAC LTD·Filed 2006·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →