Inventor · disambiguated record
Pete Benson
Also filed as: BENSON PETE · BENSON PETE A
7 granted patents·1,203 citations·filing 2003–2008
91Inventor score
Top patents by PatentIndex Score
7 records- 0199US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0299US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 0392US7459393B2Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·58 cites·15 claims
- 0491US7060526B2Wafer level methods for fabricating multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·96 cites·38 claims
- 0584US7224051B2Semiconductor component having plate and stacked diceMICRON TECHNOLOGY INC·Filed 2006·Granted May 29, 2007·34 cites·20 claims
- 0684US6998717B2Multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 14, 2006·64 cites·39 claims
- 0739US8924274B2For and method of providing portfolio risk information to investors without revealing position informationSCHMID BRIAN·Filed 2008·Granted Dec 30, 2014·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →