Inventor · disambiguated record

Boon Pew Chan

Also filed as: CHAN BOON PEW

7 granted patents·387 citations·filing 1997–2001

90Inventor score

Technology areasH10W

Files withTEXAS INSTRUMENTS INC7

Top patents by PatentIndex Score

7 records

0192US6365833B1Integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2000·Granted Apr 2, 2002·70 cites·7 claims
0289US6387729B2Method for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 2001·Granted May 14, 2002·48 cites·5 claims
0385US6468831B2Method of fabricating thin integrated circuit unitsTEXAS INSTRUMENTS INC·Filed 2001·Granted Oct 22, 2002·43 cites·9 claims
0484US5998860ADouble sided single inline memory moduleTEXAS INSTRUMENTS INC·Filed 1997·Granted Dec 7, 1999·82 cites·16 claims
0580US6177723B1Integrated circuit package and flat plate molding process for integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jan 23, 2001·64 cites·9 claims
0679US6087203AMethod for adhering and sealing a silicon chip in an integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1997·Granted Jul 11, 2000·45 cites·8 claims
0769US6274929B1Stacked double sided integrated circuit packageTEXAS INSTRUMENTS INC·Filed 1998·Granted Aug 14, 2001·35 cites·12 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →