Inventor · disambiguated record

Xin-Wei Lo

Also filed as: LO XIN-WEI

2 granted patents·0 citations·filing 2017–2018

22Inventor score

Technology areasC25D H10W

Files withCHIPBOND TECHNOLOGY CORP2

Top patents by PatentIndex Score

2 records

0140US10808331B2Electroplating system and pressure device thereofCHIPBOND TECHNOLOGY CORP·Filed 2018·Granted Oct 20, 2020·0 cites·19 claims
0224US10168582B1Chip package having a flexible substrateCHIPBOND TECHNOLOGY CORP·Filed 2017·Granted Jan 1, 2019·0 cites·7 claims

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