Inventor · disambiguated record
Pradip D. Patel
Also filed as: PATEL PRADIP · PATEL PRADIP D · PATEL PRADIP DHIRAJLAL
13 granted patents·519 citations·filing 1993–2014
93Inventor score
Top patents by PatentIndex Score
13 records- 0196US5397997ABurn-in technologies for unpackaged integrated circuitsNCHIP INC·Filed 1993·Granted Mar 14, 1995·263 cites·24 claims
- 0294US8822925B1Proximity sensor deviceMAXIM INTEGRATED PRODUCTS·Filed 2013·Granted Sep 2, 2014·18 cites·20 claims
- 0393US8604436B1Proximity sensor devicePATEL PRADIP DHIRAJLAL·Filed 2011·Granted Dec 10, 2013·72 cites·22 claims
- 0483US8269345B2Bump I/O contact for semiconductor devicePATEL PRADIP D·Filed 2007·Granted Sep 18, 2012·14 cites·17 claims
- 0582US6933602B1Semiconductor package having a thermally and electrically connected heatspreaderLSI LOGIC CORP·Filed 2003·Granted Aug 23, 2005·38 cites·12 claims
- 0682US5541524ABurn-in technologies for unpackaged integrated circuitsNCHIP INC·Filed 1993·Granted Jul 30, 1996·69 cites·22 claims
- 0779US6867480B2Electromagnetic interference package protectionLSI LOGIC CORP·Filed 2003·Granted Mar 15, 2005·29 cites·20 claims
- 0865US9372264B1Proximity sensor deviceMAXIM INTEGRATED PRODUCTS·Filed 2014·Granted Jun 21, 2016·1 cites·20 claims
- 0955US6603201B1Electronic substrateLSI LOGIC CORP·Filed 2002·Granted Aug 5, 2003·6 cites·16 claims
- 1054US6555914B1Integrated circuit package viaLSI LOGIC CORP·Filed 2001·Granted Apr 29, 2003·7 cites·14 claims
- 1150US9368466B2Bump I/O contact for semiconductor deviceMAXIM INTEGRATED PRODUCTS·Filed 2012·Granted Jun 14, 2016·0 cites·23 claims
- 1245US7436060B2Semiconductor package and process utilizing pre-formed mold cap and heatspreader assemblyLSI CORP·Filed 2004·Granted Oct 14, 2008·2 cites·14 claims
- 1338US6801437B2Electronic organic substrateLSI LOGIC CORP·Filed 2003·Granted Oct 5, 2004·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →