Inventor · disambiguated record
Guy Paul Brouillette
Also filed as: BROUILLETTE GUY · BROUILLETTE GUY P · BROUILLETTE GUY PAUL
15 granted patents·3 pending applications·682 citations·filing 1996–2009
95Inventor score
Top patents by PatentIndex Score
18 records- 0194US6056191AMethod and apparatus for forming solder bumpsIBM·Filed 1998·Granted May 2, 2000·83 cites·21 claims
- 0292US5775569AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1996·Granted Jul 7, 1998·120 cites·16 claims
- 0389US6276596B1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2000·Granted Aug 21, 2001·54 cites·20 claims
- 0485US6149122AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Nov 21, 2000·61 cites·5 claims
- 0585US6003757AApparatus for transferring solder bumps and method of usingIBM·Filed 1998·Granted Dec 21, 1999·81 cites·41 claims
- 0684US6340630B1Method for making interconnect for low temperature chip attachmentIBM·Filed 2000·Granted Jan 22, 2002·28 cites·18 claims
- 0780US6127735AInterconnect for low temperature chip attachmentIBM·Filed 1996·Granted Oct 3, 2000·41 cites·15 claims
- 0879US6527158B1Method and apparatus for forming solder bumpsIBM·Filed 2000·Granted Mar 4, 2003·60 cites·5 claims
- 0978US6133633AMethod for building interconnect structures by injection molded solder and structures builtIBM·Filed 1998·Granted Oct 17, 2000·40 cites·4 claims
- 1076US6566612B2Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 2002·Granted May 20, 2003·20 cites·8 claims
- 1173US5897336ADirect chip attach for low alpha emission interconnect systemIBM·Filed 1997·Granted Apr 27, 1999·42 cites·43 claims
- 1262US6394334B1Method and apparatus for forming solder bumpsIBM·Filed 2000·Granted May 28, 2002·24 cites·8 claims
- 1359US6341418B1Method for direct chip attach by solder bumps and an underfill layerIBM·Filed 1999·Granted Jan 29, 2002·21 cites·23 claims
- 1457US8162199B2Mold shave apparatus and injection molded soldering processBOURCHARD ERIC E·Filed 2009·Granted Apr 24, 2012·1 cites·4 claims
- 1554US2008156849A1Mold shave apparatus and injection molded soldering processIBM·Filed 2007·Application pending·0 cites
- 1652US7070087B2Method and apparatus for transferring solder bumpsIBM·Filed 2003·Granted Jul 4, 2006·6 cites·16 claims
- 1738US2002023945A1Low temperature solder column attach by injection molded solder and structure formedIBM·Filed 2001·Application pending·0 cites
- 1834US2005263571A1Injection molded continuously solidified solder method and apparatusBELANGER LUC·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Guy Paul Brouillette files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →