Inventor · disambiguated record
Keisuke Oguma
Also filed as: OGUMA Keisuke
5 granted patents·3 pending applications·4 citations·filing 2013–2024
65Inventor score
Top patents by PatentIndex Score
8 records- 0172US2024399713A1Polyamide acid, polyimide, non-thermoplastic polyimide film, multi-layered polyimide film, and metal-clad laminateKANEKA CORP·Filed 2024·Application pending·0 cites
- 0267US9826623B2Heat dissipating structureKANEKA CORP·Filed 2013·Granted Nov 21, 2017·3 cites·9 claims
- 0361US2023265252A1Non-thermoplastic polyimide film, multi-layered polyimide film and metal-clad laminateKANEKA CORP·Filed 2023·Application pending·0 cites
- 0457US10356946B2Heat dissipation structureKANEKA CORP·Filed 2013·Granted Jul 16, 2019·1 cites·8 claims
- 0555US11993740B2Low dielectric resin composition, molded article, film, multilayer film and flexible printed wiring boardKANEKA CORP·Filed 2021·Granted May 28, 2024·0 cites·11 claims
- 0652US11894592B2High frequency filterCHIBA SEIKI·Filed 2020·Granted Feb 6, 2024·0 cites·3 claims
- 0749US11984674B2Antenna deviceCHIBA SEIKI·Filed 2019·Granted May 14, 2024·0 cites·6 claims
- 0838US2015351217A1Heat dissipation structureKANEKA CORP·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →