Inventor · disambiguated record
Aki Koukami
Also filed as: KOUKAMI Aki
3 granted patents·2 pending applications·4 citations·filing 2013–2018
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0167US9826623B2Heat dissipating structureKANEKA CORP·Filed 2013·Granted Nov 21, 2017·3 cites·9 claims
- 0257US10356946B2Heat dissipation structureKANEKA CORP·Filed 2013·Granted Jul 16, 2019·1 cites·8 claims
- 0343US11798863B2Laminate and electronic deviceSEKISUI CHEMICAL CO LTD·Filed 2018·Granted Oct 24, 2023·0 cites·7 claims
- 0438US2015351217A1Heat dissipation structureKANEKA CORP·Filed 2013·Application pending·0 cites
- 0526US2017090532A1Electronic terminal equipment and method for assembling sameKANEKA CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Aki Koukami files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →