Inventor · disambiguated record
Hohyeuk Im
Also filed as: IM HOHYEUK
8 granted patents·1 pending application·47 citations·filing 2010–2019
84Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0192US8354735B2Semiconductor chips having guard rings and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2010·Granted Jan 15, 2013·16 cites·20 claims
- 0286US9252031B2Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Feb 2, 2016·12 cites·21 claims
- 0383US8623743B2Semiconductor chips having guard rings and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 7, 2014·6 cites·20 claims
- 0481US9252095B2Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2013·Granted Feb 2, 2016·7 cites·28 claims
- 0574US10553529B2Semiconductor device having flexible interconnection and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 4, 2020·2 cites·13 claims
- 0667US9881822B2Multi-stepped boat assembly for receiving semiconductor packagesKIM SUNRAK·Filed 2015·Granted Jan 30, 2018·4 cites·20 claims
- 0755US10770383B2Semiconductor device having flexible interconnection and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 8, 2020·0 cites·6 claims
- 0847US10573588B2Package substrate and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Feb 25, 2020·0 cites·17 claims
- 0941US2016111347A1Semiconductor package and method of fabricating the sameKIM JONGKOOK·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →