Inventor · disambiguated record
Tung-Chuan Wang
Also filed as: WANG TUNG-CHUAN
6 granted patents·9 pending applications·89 citations·filing 2002–2020
82Inventor score
Files withADVANCED CHIP ENG TECH INC8YANG WEN-KUN2ADAVANCED CHIP ENGINEERING TEC1HOLIEN TECH CO LTD1YOUNGTEK ELECTRONICS CORP1
Top patents by PatentIndex Score
15 records- 0195US7655501B2Wafer level package with good CTE performanceADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 2, 2010·50 cites·10 claims
- 0288US7459729B2Semiconductor image device package with die receiving through-hole and method of the sameADVANCED CHIP ENG TECH INC·Filed 2006·Granted Dec 2, 2008·16 cites·11 claims
- 0385US7525185B2Semiconductor device package having multi-chips with side-by-side configuration and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted Apr 28, 2009·14 cites·16 claims
- 0482US11145565B2Method of fabricating a chip package module with improve heat dissipation effectYOUNGTEK ELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·2 cites·15 claims
- 0568US7498556B2Image sensor module having build-in package cavity and the method of the sameADAVANCED CHIP ENGINEERING TEC·Filed 2007·Granted Mar 3, 2009·6 cites·15 claims
- 0657US2008274579A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2008·Application pending·0 cites
- 0754US10115673B1Embedded substrate package structureHOLIEN TECH CO LTD·Filed 2017·Granted Oct 30, 2018·1 cites·8 claims
- 0854US2008197435A1Wafer level image sensor package with die receiving cavity and method of making the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 0950US2008261346A1Semiconductor image device package with die receiving through-hole and method of the sameYANG WEN-KUN·Filed 2008·Application pending·0 cites
- 1049US2008142946A1Wafer level package with good cte performanceADVANCED CHIP ENG TECH INC·Filed 2006·Application pending·0 cites
- 1142US2008191333A1Image sensor package with die receiving opening and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1242US2008197478A1Semiconductor device package with die receiving through-hole and connecting through-hole and method of the sameYANG WEN-KUN·Filed 2007·Application pending·0 cites
- 1341US2008173792A1Image sensor module and the method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Application pending·0 cites
- 1431US2004037208A1Optical storage medium of limiting play timesFiled 2002·Application pending·0 cites
- 1521US2018166390A1Planar package structure and manufacturing method thereofYU CHAO CHING·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Tung-Chuan Wang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →