Inventor · disambiguated record
Kenneth Michael Fallon
Also filed as: FALLON KENNETH · FALLON KENNETH M · FALLON KENNETH MICHAEL
24 granted patents·3 pending applications·1,909 citations·filing 1990–2023
97Inventor score
Top patents by PatentIndex Score
27 records- 0198US5872051AProcess for transferring material to semiconductor chip conductive pads using a transfer substrateIBM·Filed 1995·Granted Feb 16, 1999·189 cites·9 claims
- 0298US5729896AMethod for attaching a flip chip on flexible circuit carrier using chip with metallic cap on solderIBM·Filed 1996·Granted Mar 24, 1998·185 cites·37 claims
- 0397US6759738B1Systems interconnected by bumps of joining materialIBM·Filed 1999·Granted Jul 6, 2004·133 cites·3 claims
- 0496US6204453B1Two signal one power plane circuit boardIBM·Filed 1998·Granted Mar 20, 2001·173 cites·6 claims
- 0595US5796591ADirect chip attach circuit cardIBM·Filed 1995·Granted Aug 18, 1998·205 cites·27 claims
- 0695US5634268AMethod for making direct chip attach circuit cardIBM·Filed 1995·Granted Jun 3, 1997·131 cites·36 claims
- 0791US5798285AMethod of making electronic module with multiple solder dams in soldermask windowINT BUSINESS MACHINES CORPOATI·Filed 1997·Granted Aug 25, 1998·154 cites·26 claims
- 0890US5650595AElectronic module with multiple solder dams in soldermask windowIBM·Filed 1995·Granted Jul 22, 1997·120 cites·26 claims
- 0990US5542601ARework process for semiconductor chips mounted in a flip chip configuration on an organic substrateIBM·Filed 1995·Granted Aug 6, 1996·145 cites·10 claims
- 1090US5075965ALow temperature controlled collapse chip attach processIBM·Filed 1990·Granted Dec 31, 1991·166 cites·11 claims
- 1184US7353590B2Method of forming printed circuit cardIBM·Filed 2005·Granted Apr 8, 2008·10 cites·15 claims
- 1283US5923090AMicroelectronic package and fabrication thereofIBM·Filed 1997·Granted Jul 13, 1999·68 cites·16 claims
- 1381US6344234B1Method for forming reflowed solder ball with low melting point metal capIBM·Filed 1995·Granted Feb 5, 2002·56 cites·26 claims
- 1476US6750405B1Two signal one power plane circuit boardIBM·Filed 2000·Granted Jun 15, 2004·19 cites·2 claims
- 1574US5672260AProcess for selective application of solder to circuit packagesIBM·Filed 1996·Granted Sep 30, 1997·37 cites·11 claims
- 1674US5597469AProcess for selective application of solder to circuit packagesIBM·Filed 1995·Granted Jan 28, 1997·37 cites·7 claims
- 1772US6259159B1Reflowed solder ball with low melting point metal capIBM·Filed 1997·Granted Jul 10, 2001·49 cites·17 claims
- 1868US11424728B2Piezoelectric acoustic resonator manufactured with piezoelectric thin film transfer processAKOUSTIS INC·Filed 2020·Granted Aug 23, 2022·0 cites·20 claims
- 1958US6986198B2Method of forming printed circuit cardIBM·Filed 2003·Granted Jan 17, 2006·6 cites·6 claims
- 2055US6619334B2Method of delivering fluid into constricted openings free of voidsEASTMAN KODAK CO·Filed 2001·Granted Sep 16, 2003·5 cites·5 claims
- 2154US6476902B1Liquid crystal display and method of making sameEASTMAN KODAK CO·Filed 2001·Granted Nov 5, 2002·5 cites·14 claims
- 2253US2024258991A1Methods of packaging acoustic wave resonator devices on wafers and related wafers and structuresAKOUSTIS INC·Filed 2023·Application pending·0 cites
- 2352US5656139AElectroplating apparatusIBM·Filed 1996·Granted Aug 12, 1997·13 cites·6 claims
- 2447US6674506B2Apparatus for introducing a fluid into vias formed in a liquid crystal display elementEASTMAN KODAK CO·Filed 2001·Granted Jan 6, 2004·2 cites·8 claims
- 2543US6924866B2Method of constructing a liquid crystal display element that includes dispensing an optical grade adhesive to fill vias in a transparent substrateEASTMAN KODAK CO·Filed 2001·Granted Aug 2, 2005·1 cites·7 claims
- 2635US2003098947A1Liquid crystal display elementEASTMAN KODAK CO·Filed 2001·Application pending·0 cites
- 2730US2001013423A1Flip chip attach on flexible circuit carrier using chip with metallic cap on solderFiled 1997·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →