Inventor · disambiguated record

Geng-Ming Chang

Also filed as: CHANG GENG-MING

2 granted patents·4 pending applications·1 citations·filing 2019–2025

38Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD6

Top patents by PatentIndex Score

6 records

0184US2025357420A1Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0271US11056459B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·1 cites·20 claims
0367US12438120B2Chip package structure with redistribution layer having bonding portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 7, 2025·0 cites·20 claims
0457US2025087592A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
0555US2025372552A1Bonded structure with half-oval bonding pad pair design and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
0655US2024387447A1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →