Inventor · disambiguated record
Yu-Chiang Peng
Also filed as: PENG YU-CHIANG
3 granted patents·1 pending application·1 citations·filing 2020–2023
54Inventor score
Technology areasH10F
Top patents by PatentIndex Score
4 records- 0192US11967652B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Apr 23, 2024·1 cites·14 claims
- 0279US12224359B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 11, 2025·0 cites·11 claims
- 0379US11984516B2Sensor package structure having ring-shaped solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted May 14, 2024·0 cites·14 claims
- 0467US2021305437A1Sensor package structureKINGPAK TECH INC·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →