Inventor · disambiguated record
Michele L. Miera
Also filed as: MIERA MICHELE L · MIERA MICHELE LYNN
9 granted patents·21 citations·filing 2008–2021
82Inventor score
Top patents by PatentIndex Score
9 records- 0183US7998852B2Methods for forming an RF device with trench under bond pad featureFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted Aug 16, 2011·10 cites·20 claims
- 0279US10241151B2Die crack detector and method thereforNXP USA INC·Filed 2017·Granted Mar 26, 2019·3 cites·20 claims
- 0375US9646897B2Die crack detector with integrated one-time programmable elementFREESCALE SEMICONDUCTOR INC·Filed 2013·Granted May 9, 2017·3 cites·17 claims
- 0473US10141227B1Method and system for achieving semiconductor-based circuits or systems having multiple components with one or more matched or similar characteristics or featuresNXP USA INC·Filed 2017·Granted Nov 27, 2018·3 cites·18 claims
- 0561US9123804B2LDMOS minority carrier shuntingREN XIAOWEI·Filed 2014·Granted Sep 1, 2015·1 cites·22 claims
- 0660US8772870B2LDMOS device with minority carrier shunt regionREN XIAOWEI·Filed 2012·Granted Jul 8, 2014·1 cites·20 claims
- 0750US11430743B1Transistor with shield system including multilayer shield structure arrangementNXP USA INC·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 0847US8134241B2Electronic elements and devices with trench under bond pad featureJONES JEFFREY K·Filed 2011·Granted Mar 13, 2012·0 cites·20 claims
- 0937US10707180B2Impedance matching circuit for RF devices and method thereforNXP USA INC·Filed 2018·Granted Jul 7, 2020·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →