Inventor · disambiguated record
Takeshi Shioga
Also filed as: SHIOGA TAKESHI
66 granted patents·7 pending applications·577 citations·filing 2001–2021
99Inventor score
Top patents by PatentIndex Score
73 records- 0195US7227736B2Capacitor device and method of manufacturing the sameFUJITSU LTD·Filed 2005·Granted Jun 5, 2007·34 cites·13 claims
- 0294US9711433B2Semiconductor device, method of manufacturing the same, and electronic deviceFUJITSU LTD·Filed 2015·Granted Jul 18, 2017·12 cites·12 claims
- 0394US7670940B2Plating method, semiconductor device fabrication method and circuit board fabrication methodFUJITSU LTD·Filed 2005·Granted Mar 2, 2010·26 cites·11 claims
- 0493US7863524B2Interposer and method for manufacturing the sameFUJITSU LTD·Filed 2007·Granted Jan 4, 2011·24 cites·12 claims
- 0592US7355290B2Interposer and method for fabricating the sameFUJITSU LTD·Filed 2006·Granted Apr 8, 2008·20 cites·9 claims
- 0691US7940516B2Capacitor and electronic substrate including the sameFUJITSU LTD·Filed 2010·Granted May 10, 2011·11 cites·9 claims
- 0791US7161793B2Layer capacitor element and production process as well as electronic deviceFUJITSU LTD·Filed 2003·Granted Jan 9, 2007·52 cites·12 claims
- 0891US7102367B2Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereofFUJITSU LTD·Filed 2003·Granted Sep 5, 2006·34 cites·7 claims
- 0988US7466152B2Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereofFUJITSU LTD·Filed 2006·Granted Dec 16, 2008·12 cites·7 claims
- 1087US9142476B2Semiconductor package, cooling mechanism and method for manufacturing semiconductor packageFUJITSU LTD·Filed 2013·Granted Sep 22, 2015·7 cites·18 claims
- 1186US8780560B2Loop heat pipe, and electronic apparatus including loop heat pipeOGATA SUSUMU·Filed 2012·Granted Jul 15, 2014·8 cites·11 claims
- 1286US7846852B2Method for manufacturing capacitor embedded in interposerFUJITSU LTD·Filed 2010·Granted Dec 7, 2010·6 cites·3 claims
- 1386US7795739B2Semiconductor device, method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Sep 14, 2010·11 cites·7 claims
- 1486US7557014B2Semiconductor system-in-packageFUJITSU LTD·Filed 2006·Granted Jul 7, 2009·12 cites·6 claims
- 1586US7405366B2Interposer and electronic device fabrication methodFUJITSU LTD·Filed 2006·Granted Jul 29, 2008·12 cites·11 claims
- 1686US6853051B2Thin film capacitor and method of manufacturing the sameFUJITSU LTD·Filed 2002·Granted Feb 8, 2005·35 cites·7 claims
- 1784US7176556B2Semiconductor system-in-packageFUJITSU LTD·Filed 2002·Granted Feb 13, 2007·33 cites·13 claims
- 1883US7745924B2Capacitor embedded in interposer, semiconductor device including the same, and method for manufacturing capacitor embedded in interposerFUJITSU LTD·Filed 2008·Granted Jun 29, 2010·8 cites·15 claims
- 1983US7614142B2Method for fabricating an interposerFUJITSU LTD·Filed 2008·Granted Nov 10, 2009·11 cites·12 claims
- 2082US7298050B2Semiconductor device, method of manufacturing the same, capacitor structure, and method of manufacturing the sameFUJITSU LTD·Filed 2005·Granted Nov 20, 2007·9 cites·6 claims
- 2182US6882516B2Thin film capacitor and method of manufacturing the sameFUJITSU LTD·Filed 2003·Granted Apr 19, 2005·21 cites·19 claims
- 2281US8330480B2Interconnection card for inspection, manufacture method for interconnection card, and inspection method using interconnection cardSHIOGA TAKESHI·Filed 2010·Granted Dec 11, 2012·4 cites·9 claims
- 2381US7793396B2Manufacturing method of capacitorFUJITSU LTD·Filed 2007·Granted Sep 14, 2010·7 cites·6 claims
- 2481US7339277B2Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrateFUJITSU LTD·Filed 2005·Granted Mar 4, 2008·8 cites·7 claims
- 2580US11044830B2Loop heat pipe and electronic deviceFUJITSU LTD·Filed 2020·Granted Jun 22, 2021·1 cites·9 claims
- 2680US7172945B2Method of manufacturing thin film capacitorFUJITSU LTD·Filed 2004·Granted Feb 6, 2007·24 cites·9 claims
- 2779US8479386B2Method for manufacturing interposerSHIOGA TAKESHI·Filed 2010·Granted Jul 9, 2013·5 cites·4 claims
- 2879US6624501B2Capacitor and semiconductor deviceFUJITSU LTD·Filed 2001·Granted Sep 23, 2003·21 cites·34 claims
- 2978US10624238B2Loop heat pipe and manufacturing method for loop heat pipe and electronic deviceFUJITSU LTD·Filed 2018·Granted Apr 14, 2020·2 cites·17 claims
- 3077US7937830B2Interposer and electronic device fabrication methodFUJITSU LTD·Filed 2008·Granted May 10, 2011·5 cites·2 claims
- 3176US10420253B2Loop heat pipe, manufacturing method thereof, and electronic deviceFUJITSU LTD·Filed 2018·Granted Sep 17, 2019·2 cites·19 claims
- 3276US7365327B2Electromagnetic radiation sensor and method for fabricating the sameFUJITSU LTD·Filed 2005·Granted Apr 29, 2008·3 cites·18 claims
- 3371US10881021B2Loop heat pipe and fabrication method therefor, and electronic deviceFUJITSU LTD·Filed 2018·Granted Dec 29, 2020·1 cites·11 claims
- 3471US8264063B2Capacitive element, method of manufacture of the same, and semiconductor deviceSHIOGA TAKESHI·Filed 2008·Granted Sep 11, 2012·4 cites·11 claims
- 3571US7778009B2Thin-film capacitor and method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Aug 17, 2010·6 cites·10 claims
- 3669US8344386B2Laminated thin-film device, manufacturing method thereof, and circuitFUJITSU LTD·Filed 2010·Granted Jan 1, 2013·2 cites·20 claims
- 3769US8035981B2Semiconductor device and manufacturing method of the sameFUJITSU LTD·Filed 2008·Granted Oct 11, 2011·3 cites·15 claims
- 3869US7832069B2Capacitor device and method of manufacturing the sameFUJITSU LTD·Filed 2007·Granted Nov 16, 2010·4 cites·6 claims
- 3967US11536518B2Fabrication method for loop heat pipeFUJITSU LTD·Filed 2020·Granted Dec 27, 2022·0 cites·3 claims
- 4067US6803617B2Capacitor and method for fabricating the sameFUJITSU LTD·Filed 2003·Granted Oct 12, 2004·12 cites·13 claims
- 4166US11009927B2Loop heat pipe, method of manufacturing the same, and electronic deviceSHINKO ELECTRIC IND CO·Filed 2016·Granted May 18, 2021·1 cites·10 claims
- 4265US9455212B2Loop heat pipe system and information processing apparatusUCHIDA HIROKI·Filed 2012·Granted Sep 27, 2016·2 cites·13 claims
- 4365US7405921B2Layer capacitor element and production process as well as electronic deviceFUJITSU LTD·Filed 2006·Granted Jul 29, 2008·3 cites·18 claims
- 4465US7349195B2Thin film capacitor and method for manufacturing the sameFUJITSU LTD·Filed 2006·Granted Mar 25, 2008·3 cites·4 claims
- 4565US6894396B2Semiconductor device with capacitorFUJITSU LTD·Filed 2003·Granted May 17, 2005·10 cites·6 claims
- 4664US7417276B2Thin film capacitor and fabrication method thereofFUJITSU LTD·Filed 2006·Granted Aug 26, 2008·1 cites·6 claims
- 4763US11789505B2Loop heat pipeSHINKO ELECTRIC IND CO·Filed 2021·Granted Oct 17, 2023·0 cites·11 claims
- 4861US8203198B2Thin film capacitor device used for a decoupling capacitor and having a resistor insideSHIOGA TAKESHI·Filed 2006·Granted Jun 19, 2012·2 cites·8 claims
- 4961US6873038B2Capacitor and semiconductor device and method for fabricating the semiconductor deviceFUJITSU LTD·Filed 2003·Granted Mar 29, 2005·7 cites·10 claims
- 5060US7439199B2Capacitive element, method of manufacture of the same, and semiconductor deviceFUJITSU LTD·Filed 2006·Granted Oct 21, 2008·1 cites·8 claims
Showing the top 50 of 73 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Takeshi Shioga files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →