Inventor · disambiguated record
Honjin En
Also filed as: EN HONJIN
7 granted patents·1 pending application·259 citations·filing 1999–2012
89Inventor score
Top patents by PatentIndex Score
8 records- 0197US8148643B2Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2007·Granted Apr 3, 2012·56 cites·10 claims
- 0297US6591495B2Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic platingIBIDEN CO LTD·Filed 2001·Granted Jul 15, 2003·102 cites·5 claims
- 0391US7415761B2Method of manufacturing multilayered circuit boardIBIDEN CO LTD·Filed 2003·Granted Aug 26, 2008·35 cites·9 claims
- 0487US7832098B2Method of manufacturing a multilayered printed circuit boardIBIDEN CO LTD·Filed 2008·Granted Nov 16, 2010·10 cites·10 claims
- 0583US6613986B1Multilayer build-up wiring boardIBIDEN CO LTD·Filed 1999·Granted Sep 2, 2003·42 cites·15 claims
- 0680US7847318B2Multilayer build-up wiring board including a chip mount regionIBIDEN CO LTD·Filed 2009·Granted Dec 7, 2010·6 cites·9 claims
- 0764US7514779B2Multilayer build-up wiring boardIBIDEN CO LTD·Filed 2002·Granted Apr 7, 2009·8 cites·11 claims
- 0852US2012125680A1Multilayered printed circuit board and manufacturing method thereofHIROSE NAOHIRO·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →