Inventor · disambiguated record
Curtis Hollingshead
Also filed as: HOLLINGSHEAD CURTIS
5 granted patents·36 citations·filing 2001–2006
79Inventor score
Files withMICRON TECHNOLOGY INC5
Top patents by PatentIndex Score
5 records- 0174US6768209B1Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2003·Granted Jul 27, 2004·16 cites·42 claims
- 0273US7442578B2Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devicesMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 28, 2008·4 cites·20 claims
- 0371US6812064B2Ozone treatment of a ground semiconductor die to improve adhesive bonding to a substrateMICRON TECHNOLOGY INC·Filed 2001·Granted Nov 2, 2004·13 cites·72 claims
- 0448US7094628B2Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 22, 2006·2 cites·47 claims
- 0547US7170184B2Treatment of a ground semiconductor die to improve adhesive bonding to a substrateMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 30, 2007·1 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →