Inventor · disambiguated record
Holman Chen
Also filed as: CHEN HOLMAN
4 granted patents·2 pending applications·29 citations·filing 2002–2006
71Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD6
Top patents by PatentIndex Score
6 records- 0168US7230323B2Ground-enhanced semiconductor package and lead frame for the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Granted Jun 12, 2007·24 cites·18 claims
- 0246US7126229B2Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Oct 24, 2006·3 cites·9 claims
- 0344US2007007669A1Wire-bonding method and semiconductor package using the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2006·Application pending·0 cites
- 0443US6806565B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2002·Granted Oct 19, 2004·2 cites·8 claims
- 0537US7008826B2Lead-frame-based semiconductor package and fabrication method thereofSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2004·Granted Mar 7, 2006·0 cites·11 claims
- 0635US2004217450A1Leadframe-based non-leaded semiconductor package and method of fabricating the sameSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Holman Chen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →