Inventor · disambiguated record
Daisaku Akiyama
Also filed as: AKIYAMA DAISAKU
7 granted patents·4 pending applications·126 citations·filing 1994–2021
81Inventor score
Files withMEC CO LTD11
Top patents by PatentIndex Score
11 records- 0190US5532094AComposition for treating copper or copper alloy surfacesMEC CO LTD·Filed 1995·Granted Jul 2, 1996·96 cites·6 claims
- 0271US5439783AComposition for treating copper or copper alloysMEC CO LTD·Filed 1994·Granted Aug 8, 1995·20 cites·7 claims
- 0369US7285229B2Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2004·Granted Oct 23, 2007·10 cites·11 claims
- 0461US12157837B2Adhesive composition, method for producing surface-treated metal member, and method for producing metal-resin composite bodyMEC CO LTD·Filed 2020·Granted Dec 3, 2024·0 cites·10 claims
- 0551US10329453B2Film-forming composition, method for producing surface-treated metal member, and method for producing metal-resin compositeMEC CO LTD·Filed 2017·Granted Jun 25, 2019·0 cites·7 claims
- 0649US12460303B2Etching agent and method for producing circuit boardMEC CO LTD·Filed 2021·Granted Nov 4, 2025·0 cites·17 claims
- 0748US2008011981A1Etchant and replenishment solution therefor, and etching method and method for producing wiring board using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 0845US2008073614A1Metal removing solution and metal removing method using the sameMEC CO LTD·Filed 2007·Application pending·0 cites
- 0944US10801112B2Composition for forming coating, production method for surface-treated metal member, and production method for metal-resin compositeMEC CO LTD·Filed 2017·Granted Oct 13, 2020·0 cites·14 claims
- 1037US2017268112A1Etching agent and replenishing solution therefor, method for roughening surface of magnesium component, and method for manufacturing magnesium-resin compositeMEC CO LTD·Filed 2015·Application pending·0 cites
- 1130US2017167033A1Etching agent and replenishing liquidMEC CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →