Inventor · disambiguated record
Bernard H. Glasauer
Also filed as: GLASAUER BERNARD H
1 granted patent·2 pending applications·7 citations·filing 2018–2022
28Inventor score
Files withJUNIPER NETWORKS INC3
Top patents by PatentIndex Score
3 records- 0184US11322367B1System and method for attaching an integrated circuit package to a printed circuit board with solder balls having a coined surface profileJUNIPER NETWORKS INC·Filed 2018·Granted May 3, 2022·7 cites·12 claims
- 0250US2024170417A1Stiffener for a semiconductor packageJUNIPER NETWORKS INC·Filed 2022·Application pending·0 cites
- 0343US2022312591A1Substrate with conductive pads and conductive layersJUNIPER NETWORKS INC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →