Inventor · disambiguated record
Chia-Hung Lai
Also filed as: LAI CHIA-HUNG
11 granted patents·5 pending applications·100 citations·filing 1997–2024
87Inventor score
Files withTAIWAN SEMICONDUCTOR MFG6TAIWAN SEMICONDUCTOR MFG CO LTD3IND TECH RES INST2LAI CHIA HUNG2CHROMA ATE INC1
Top patents by PatentIndex Score
16 records- 0183US6006764AMethod of stripping photoresist from Al bonding pads that prevents corrosionTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Dec 28, 1999·73 cites·17 claims
- 0277US9066566B2Transparent shell structure for luggage and the likeLAI CHIA-HUNG·Filed 2013·Granted Jun 30, 2015·8 cites·8 claims
- 0370US8461857B2Distance adjustment system for use in solar wafer inspection machine and inspection machine provided with sameLAI CHIA-HUNG·Filed 2011·Granted Jun 11, 2013·1 cites·10 claims
- 0465US2025210775A1Pressurizing apparatus for battery trayCHROMA ATE INC·Filed 2024·Application pending·0 cites
- 0558US7015129B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Mar 21, 2006·7 cites·20 claims
- 0657US11094579B2Method of forming shallow trench isolation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 17, 2021·0 cites·20 claims
- 0756US7160811B2Laminated silicate glass layer etch stop method for fabricating microelectronic productTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Jan 9, 2007·5 cites·19 claims
- 0850US2025219998A1Security managing module and security managing method for endpoint deviceIND TECH RES INST·Filed 2023·Application pending·0 cites
- 0949US10699938B2Shallow trench isolation structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jun 30, 2020·0 cites·20 claims
- 1049US6844626B2Bond pad scheme for Cu processTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Jan 18, 2005·3 cites·13 claims
- 1147US2024089188A1Monitoring system and monitoring method of network latencyIND TECH RES INST·Filed 2022·Application pending·0 cites
- 1245US7056821B2Method for manufacturing dual damascene structure with a trench formed firstTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 6, 2006·3 cites·14 claims
- 1341US10871720B2Apparatus for supporting a semiconductor wafer and method of vibrating a semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Dec 22, 2020·0 cites·20 claims
- 1438US9269257B2Method and system for reminding reader of fatigue in reading while using electronic deviceUNIV NAT CHENG KUNG·Filed 2013·Granted Feb 23, 2016·0 cites·12 claims
- 1536US2006194426A1Method for manufacturing dual damascene structure with a trench formed firstYANG CHIN-TIEN·Filed 2006·Application pending·0 cites
- 1634US2005173799A1Interconnect structure and method for its fabricatingTAIWAN SEMICONDUCTOR MFG·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →